Ryutaro Tanaka

Person

Kita-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Primer resin for semiconductor device and semiconductor device
- Patent number 8,410,620
- Issue date Apr 2, 2013
- Nippon Kayaku Kabushiki Kaisha
- Makoto Uchida
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting resin composition and use thereof
- Patent number 8,080,319
- Issue date Dec 20, 2011
- Kippon Kayaku Kabushiki Kaisha
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Tetraglycidyl ether of 1,1,2,2-tetrakis(hydroxyphenyl)ethane
- Patent number 7,884,172
- Issue date Feb 8, 2011
- Nippon Kayaku Kabushiki Kaisha
- Masataka Nakanishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Imide-urethane resin, photosensitive resin composition including th...
- Patent number 7,781,147
- Issue date Aug 24, 2010
- Nippon Kayaku Kabushiki Kaisha
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition and curing product thereof
- Patent number 7,374,862
- Issue date May 20, 2008
- Nippon Kayaku Kabushiki Kaisha
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Polyimide Resin, Resin Composition Comprising Polyimide Resin and C...
- Publication number 20240343865
- Publication date Oct 17, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kengo Nishimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Isocyanate-Modified Polyimide Resin, Resin Composition and Cured Pr...
- Publication number 20230331915
- Publication date Oct 19, 2023
- Nippon Kayaku Kabushiki-Kaisha
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyamic Acid Resin, Polyimide Resin, and Resin Composition Includi...
- Publication number 20220169791
- Publication date Jun 2, 2022
- Nippon Kayaku Kabushiki-Kaisha
- Kenta Sugawara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Heat-Resistant Adhesive
- Publication number 20120288725
- Publication date Nov 15, 2012
- NIPPON KAYAKU KABUSHIKI KAISHA
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Copper foil with primer resin layer and laminated sheet using the same
- Publication number 20100233476
- Publication date Sep 16, 2010
- Makoto Uchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20100207282
- Publication date Aug 19, 2010
- NIPPON KAYAKU KABUSHIKI KAISHA
- Makoto Uchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COPPER FOIL WITH RESIN LAYER
- Publication number 20100129604
- Publication date May 27, 2010
- Makoto Uchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyamide Resin as Well as Epoxy Resin Composition Using the Same a...
- Publication number 20100096169
- Publication date Apr 22, 2010
- NIPPONKAYAKU KABUSHIKIKAISHA
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION
- Publication number 20100035182
- Publication date Feb 11, 2010
- NIPPON KAYAKU KABUSHIKI KAISHA
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting Resin Composition and Use thereof
- Publication number 20090286087
- Publication date Nov 19, 2009
- NIPPON KAYAKU KABUSHIKI KAISHA
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin a...
- Publication number 20090202793
- Publication date Aug 13, 2009
- Nippon Kayaku Kabushiki Kaisha
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin, Epoxy Resin Composition, Photosensitive Resin Composit...
- Publication number 20090131607
- Publication date May 21, 2009
- Masataka Nakanishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive resin composition and cured article thereof
- Publication number 20090042126
- Publication date Feb 12, 2009
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin and Epoxy Resin Composition
- Publication number 20090012203
- Publication date Jan 8, 2009
- Nippon Kayaku Kabushiki-Kaisha
- Masataka Nakanishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyamide Acid Resin Containing Unsaturated Group, Photosensitive R...
- Publication number 20080306180
- Publication date Dec 11, 2008
- Chika Amishima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive Resin Composition and Cured Product Thereof
- Publication number 20080286688
- Publication date Nov 20, 2008
- Hiroo Koyanagi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Imide-Urethane Resin, Photosensitive Resin Composition Including th...
- Publication number 20080268373
- Publication date Oct 30, 2008
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Unsaturated Group-Containing Polyimide Resin, Photosensitive Resin...
- Publication number 20080146692
- Publication date Jun 19, 2008
- Ryuji Uehara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin, Epoxy Resin Composition And Cured Product Thereof
- Publication number 20080021173
- Publication date Jan 24, 2008
- Masataka Nakanishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive resin composition and cured product thereof
- Publication number 20070161100
- Publication date Jul 12, 2007
- Nippon Kayaku Kabushiki-Kaisha
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive resin composition and curing product thereof
- Publication number 20060102051
- Publication date May 18, 2006
- Nippon Kayaku Kabushiki-Kaisha
- Ryutaro Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Ryutaro Tanaka

Person

Patents Grantslast 30 patents

Primer resin for semiconductor device and semiconductor device

Thermosetting resin composition and use thereof

Tetraglycidyl ether of 1,1,2,2-tetrakis(hydroxyphenyl)ethane

Imide-urethane resin, photosensitive resin composition including th...

Photosensitive resin composition and curing product thereof

Patents Applicationslast 30 patents

Polyimide Resin, Resin Composition Comprising Polyimide Resin and C...

Isocyanate-Modified Polyimide Resin, Resin Composition and Cured Pr...

Polyamic Acid Resin, Polyimide Resin, and Resin Composition Includi...

Heat-Resistant Adhesive

Copper foil with primer resin layer and laminated sheet using the same

PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

COPPER FOIL WITH RESIN LAYER

Polyamide Resin as Well as Epoxy Resin Composition Using the Same a...

PHOTOSENSITIVE RESIN COMPOSITION

Thermosetting Resin Composition and Use thereof

Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin a...

Epoxy Resin, Epoxy Resin Composition, Photosensitive Resin Composit...

Photosensitive resin composition and cured article thereof

Epoxy Resin and Epoxy Resin Composition

Polyamide Acid Resin Containing Unsaturated Group, Photosensitive R...

Photosensitive Resin Composition and Cured Product Thereof

Imide-Urethane Resin, Photosensitive Resin Composition Including th...

Unsaturated Group-Containing Polyimide Resin, Photosensitive Resin...

Epoxy Resin, Epoxy Resin Composition And Cured Product Thereof

Photosensitive resin composition and cured product thereof

Photosensitive resin composition and curing product thereof