Ryuuji MORI

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Kyoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Sensor wiring substrate, sensor package, and sensor device
- Patent number 11,105,738
- Issue date Aug 31, 2021
- Kyocera Corporation
- Yuusuke Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid body, package, and electronic apparatus
- Patent number 9,859,179
- Issue date Jan 2, 2018
- KYOCERA Corporation
- Ryuuji Mori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL WAVEGUIDE PACKAGE AND LIGHT-EMITTING DEVICE
- Publication number 20240272379
- Publication date Aug 15, 2024
- Kyocera Corporation
- Yoshiaki Itakura
- G02 - OPTICS
Information Patent Application
SENSOR WIRING SUBSTRATE, SENSOR PACKAGE, AND SENSOR DEVICE
- Publication number 20190376889
- Publication date Dec 12, 2019
- KYOCERA CORPORATION
- Yuusuke TAKEI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LID BODY, PACKAGE, AND ELECTRONIC APPARATUS
- Publication number 20160105980
- Publication date Apr 14, 2016
- KYOCERA CORPORATION
- Ryuuji MORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR