Ryuya Koizumi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plating method and plating apparatus
- Patent number 12,221,714
- Issue date Feb 11, 2025
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 12,191,178
- Issue date Jan 7, 2025
- Ebara Corporation
- Jumpei Fujikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for plating and method of plating
- Patent number 12,054,841
- Issue date Aug 6, 2024
- Ebara Corporation
- Kazuma Ideguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of constructing prediction model that predicts number of pla...
- Patent number 11,461,647
- Issue date Oct 4, 2022
- Ebara Corporation
- Kunio Oishi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 11,315,812
- Issue date Apr 26, 2022
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 11,286,577
- Issue date Mar 29, 2022
- Ebara Corporation
- Ryuya Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheduler, substrate processing apparatus, and substrate conveyance...
- Patent number 11,099,546
- Issue date Aug 24, 2021
- Ebara Corporation
- Koji Nonobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating system, a plating system control method, and a storage medi...
- Patent number 11,098,414
- Issue date Aug 24, 2021
- Ebara Corporation
- Takashi Mitsuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Scheduler, substrate processing apparatus, and substrate conveyance...
- Patent number 10,824,135
- Issue date Nov 3, 2020
- Ebara Corporation
- Koji Nonobe
- G05 - CONTROLLING REGULATING
Information Patent Grant
Scheduler, substrate processing apparatus, and substrate conveyance...
- Patent number 10,824,138
- Issue date Nov 3, 2020
- Ebara Corporation
- Koji Nonobe
- G05 - CONTROLLING REGULATING
Information Patent Grant
Substrate holding member, substrate processing device, method for c...
- Patent number 10,818,527
- Issue date Oct 27, 2020
- Ebara Corporation
- Ryuya Koizumi
- G01 - MEASURING TESTING
Information Patent Grant
Plating method and plating apparatus
- Patent number 10,648,099
- Issue date May 12, 2020
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating system, a plating system control method, and a storage medi...
- Patent number 10,501,862
- Issue date Dec 10, 2019
- Ebara Corporation
- Takashi Mitsuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling display of operation of semiconductor manufac...
- Patent number 10,446,422
- Issue date Oct 15, 2019
- Ebara Corporation
- Masayuki Fujiki
- G05 - CONTROLLING REGULATING
Information Patent Grant
Plating apparatus
- Patent number 10,077,504
- Issue date Sep 18, 2018
- Ebara Corporation
- Yoshio Minami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus
- Patent number 9,624,594
- Issue date Apr 18, 2017
- Ebara Corporation
- Yoshio Minami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Scheduler, substrate processing apparatus, and method of transferri...
- Patent number 8,655,472
- Issue date Feb 18, 2014
- Ebara Corporation
- Ryuya Koizumi
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DETECTING LEAKAGE
- Publication number 20240192075
- Publication date Jun 13, 2024
- EBARA CORPORATION
- Yosuke NAGASAWA
- G01 - MEASURING TESTING
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20230203701
- Publication date Jun 29, 2023
- EBARA CORPORATION
- Ryuya KOIZUMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR PLATING AND METHOD OF PLATING
- Publication number 20230146732
- Publication date May 11, 2023
- EBARA CORPORATION
- Kazuma IDEGUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR DETERMINING OPTIMAL NUMBER OF SUBMODULES FOR USE IN SEMI...
- Publication number 20220222524
- Publication date Jul 14, 2022
- EBARA CORPORATION
- Ryuya Koizumi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...
- Publication number 20220181180
- Publication date Jun 9, 2022
- EBARA CORPORATION
- Jumpei FUJIKATA
- G05 - CONTROLLING REGULATING
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20220170175
- Publication date Jun 2, 2022
- EBARA CORPORATION
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE...
- Publication number 20210011462
- Publication date Jan 14, 2021
- EBARA CORPORATION
- Koji Nonobe
- G05 - CONTROLLING REGULATING
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20200232115
- Publication date Jul 23, 2020
- EBARA CORPORATION
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONSTRUCTING PREDICTION MODEL THAT PREDICTS NUMBER OF PLA...
- Publication number 20200193294
- Publication date Jun 18, 2020
- EBARA CORPORATION
- Kunio Oishi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDI...
- Publication number 20200056301
- Publication date Feb 20, 2020
- EBARA CORPORATION
- Takashi MITSUYA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE...
- Publication number 20190271970
- Publication date Sep 5, 2019
- EBARA CORPORATION
- Koji NONOBE
- G05 - CONTROLLING REGULATING
Information Patent Application
SUBSTRATE HOLDING MEMBER, SUBSTRATE PROCESSING DEVICE, METHOD FOR C...
- Publication number 20190252213
- Publication date Aug 15, 2019
- EBARA CORPORATION
- Ryuya KOIZUMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...
- Publication number 20180294174
- Publication date Oct 11, 2018
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING DISPLAY OF OPERATION OF SEMICONDUCTOR MANUFAC...
- Publication number 20180286723
- Publication date Oct 4, 2018
- EBARA CORPORATION
- Masayuki FUJIKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20180266009
- Publication date Sep 20, 2018
- EBARA CORPORATION
- Ryuya KOIZUMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE...
- Publication number 20180203434
- Publication date Jul 19, 2018
- EBARA CORPORATION
- Koji NONOBE
- G05 - CONTROLLING REGULATING
Information Patent Application
PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDI...
- Publication number 20180038008
- Publication date Feb 8, 2018
- EBARA CORPORATION
- Takashi MITSUYA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20170175285
- Publication date Jun 22, 2017
- EBARA CORPORATION
- Yoshio MINAMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20150308010
- Publication date Oct 29, 2015
- EBARA CORPORATION
- Ryuya KOIZUMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20140245954
- Publication date Sep 4, 2014
- Yoshio MINAMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF TRANSFERRI...
- Publication number 20110172800
- Publication date Jul 14, 2011
- Ryuya KOIZUMI
- G06 - COMPUTING CALCULATING COUNTING

Ryuya Koizumi

Person

Patents Grantslast 30 patents

Plating method and plating apparatus

Semiconductor manufacturing apparatus, failure prediction method fo...

Apparatus for plating and method of plating

Method of constructing prediction model that predicts number of pla...

Semiconductor manufacturing apparatus, failure prediction method fo...

Plating method and plating apparatus

Scheduler, substrate processing apparatus, and substrate conveyance...

Plating system, a plating system control method, and a storage medi...

Scheduler, substrate processing apparatus, and substrate conveyance...

Scheduler, substrate processing apparatus, and substrate conveyance...

Substrate holding member, substrate processing device, method for c...

Plating method and plating apparatus

Plating system, a plating system control method, and a storage medi...

Method of controlling display of operation of semiconductor manufac...

Plating apparatus

Plating apparatus

Scheduler, substrate processing apparatus, and method of transferri...

Patents Applicationslast 30 patents

METHOD OF DETECTING LEAKAGE

PLATING APPARATUS AND PLATING METHOD

APPARATUS FOR PLATING AND METHOD OF PLATING

METHOD FOR DETERMINING OPTIMAL NUMBER OF SUBMODULES FOR USE IN SEMI...

SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...

PLATING METHOD AND PLATING APPARATUS

SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE...

PLATING METHOD AND PLATING APPARATUS

METHOD OF CONSTRUCTING PREDICTION MODEL THAT PREDICTS NUMBER OF PLA...

PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDI...

SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE...

SUBSTRATE HOLDING MEMBER, SUBSTRATE PROCESSING DEVICE, METHOD FOR C...

SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...

METHOD OF CONTROLLING DISPLAY OF OPERATION OF SEMICONDUCTOR MANUFAC...

PLATING METHOD AND PLATING APPARATUS

SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE...

PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDI...

PLATING APPARATUS

SUBSTRATE PROCESSING METHOD

PLATING APPARATUS

SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF TRANSFERRI...