S. Daniel Cromwell

Person

Penryn, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Computing device
- Patent number 7,646,595
- Issue date Jan 12, 2010
- Hewlett-Packard Development Company, L.P.
- Stephan K. Barsun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force distributing spring element
- Patent number 7,539,027
- Issue date May 26, 2009
- Hewlett-Packard Development Company, L.P.
- Daniel Lyle Callahan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge lock
- Patent number 7,397,666
- Issue date Jul 8, 2008
- Hewlett-Packard Development Company, L.P.
- Stephan K. Barsun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly
- Patent number 7,345,891
- Issue date Mar 18, 2008
- Hewlett-Packard Development Company, L.P.
- Stephan K. Barsun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force distributing spring element
- Patent number 7,289,335
- Issue date Oct 30, 2007
- Hewlett-Packard Development Company, L.P.
- Daniel Lyle Callahan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly
- Patent number 7,061,126
- Issue date Jun 13, 2006
- Hewlett-Packard Development Company, L.P.
- Gregory S. Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spring-loaded heat sink assembly for a circuit assembly
- Patent number 6,746,270
- Issue date Jun 8, 2004
- Hewlett-Packard Development Company, L.P.
- Eric C. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spring-loaded heat sink assembly for a circuit assembly
- Patent number 6,634,890
- Issue date Oct 21, 2003
- Hewlett-Packard Development Company, L.P.
- Eric C. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a modular integrated apparatus for heat dissipation
- Patent number 6,330,745
- Issue date Dec 18, 2001
- Hewlett-Packard Company
- S. Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electrical and mechanical attachment, and...
- Patent number 6,198,630
- Issue date Mar 6, 2001
- Hewlett-Packard Company
- S. Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold plate arrangement for cooling processor and companion voltage...
- Patent number 6,191,945
- Issue date Feb 20, 2001
- Hewlett-Packard Company
- Christian L. Belady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perimeter clamp for mounting and aligning a semiconductor component...
- Patent number 6,084,178
- Issue date Jul 4, 2000
- Hewlett-Packard Company
- S. Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a modular integrated apparatus for heat di...
- Patent number 6,061,235
- Issue date May 9, 2000
- Hewlett-Packard Company
- S. Daniel Cromwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a modular integrated apparatus for multi-f...
- Patent number 5,926,370
- Issue date Jul 20, 1999
- Hewlett-Packard Company
- S. Daniel Cromwell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board inserter and extractor
- Patent number 5,506,758
- Issue date Apr 9, 1996
- Hewlett-Packard Company
- S. Daniel Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retention clip to mount a handle to a circuit board
- Patent number 5,502,622
- Issue date Mar 26, 1996
- Hewlett-Packard Company
- S. Daniel Cromwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPUTING DEVICE
- Publication number 20080204993
- Publication date Aug 28, 2008
- Hewlett-Packard Development Company L.P.
- Stephan K. Barsun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE LOCK
- Publication number 20080101031
- Publication date May 1, 2008
- Hewlett-Packard Development Company L.P.
- Stephan K. Barsun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORCE DISTRIBUTING SPRING ELEMENT
- Publication number 20080055870
- Publication date Mar 6, 2008
- Daniel Lyle Callahan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board assembly
- Publication number 20050073813
- Publication date Apr 7, 2005
- Hewlett-Packard Development Company, L.P.
- Gregory S. Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board assembly
- Publication number 20050073817
- Publication date Apr 7, 2005
- Hewlett-Packard Development Company, L.P.
- Stephan K. Barsun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Force distributing spring element
- Publication number 20050007748
- Publication date Jan 13, 2005
- Daniel Lyle Callahan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Spring-loaded heat sink assembly for a circuit assembly
- Publication number 20040038583
- Publication date Feb 26, 2004
- Eric C. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Spring-loaded heat sink assembly for a circuit assembly
- Publication number 20020076974
- Publication date Jun 20, 2002
- Eric C. Peterson
- H01 - BASIC ELECTRIC ELEMENTS

S. Daniel Cromwell

Person

Patents Grantslast 30 patents

Computing device

Force distributing spring element

Wedge lock

Circuit board assembly

Force distributing spring element

Circuit board assembly

Spring-loaded heat sink assembly for a circuit assembly

Spring-loaded heat sink assembly for a circuit assembly

Method for making a modular integrated apparatus for heat dissipation

Method and apparatus for electrical and mechanical attachment, and...

Cold plate arrangement for cooling processor and companion voltage...

Perimeter clamp for mounting and aligning a semiconductor component...

Method and apparatus for a modular integrated apparatus for heat di...

Method and apparatus for a modular integrated apparatus for multi-f...

Circuit board inserter and extractor

Retention clip to mount a handle to a circuit board

Patents Applicationslast 30 patents

COMPUTING DEVICE

WEDGE LOCK

FORCE DISTRIBUTING SPRING ELEMENT

Circuit board assembly

Circuit board assembly

Force distributing spring element

Spring-loaded heat sink assembly for a circuit assembly

Spring-loaded heat sink assembly for a circuit assembly