S. Derek Hinkle

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-part lead frame
- Patent number 7,321,160
- Issue date Jan 22, 2008
- Micron Technology, Inc.
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures including protective layers formed...
- Patent number 7,199,464
- Issue date Apr 3, 2007
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-part lead frame with dissimilar materials
- Patent number 6,946,722
- Issue date Sep 20, 2005
- Micron Technology, Inc.
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-part lead frame with dissimilar materials and method of manuf...
- Patent number 6,902,952
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layers formed on semiconductor device components so as t...
- Patent number 6,885,108
- Issue date Apr 26, 2005
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-part lead frame with dissimilar materials
- Patent number 6,570,244
- Issue date May 27, 2003
- Micron Technology, Inc.
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-part lead frame with dissimilar materials and method of manuf...
- Patent number 6,362,022
- Issue date Mar 26, 2002
- Micron Technology, Inc.
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-part lead frame with dissimilar materials and method of manuf...
- Patent number 6,140,154
- Issue date Oct 31, 2000
- Micron Technology, Inc.
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-part lead frame with dissimilar materials and method of manuf...
- Patent number 6,072,228
- Issue date Jun 6, 2000
- Micron Technology, Inc.
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20070057353
- Publication date Mar 15, 2007
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20070057354
- Publication date Mar 15, 2007
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20070001274
- Publication date Jan 4, 2007
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20060125065
- Publication date Jun 15, 2006
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20050224928
- Publication date Oct 13, 2005
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device structures including protective layers formed...
- Publication number 20050156328
- Publication date Jul 21, 2005
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20050146002
- Publication date Jul 7, 2005
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming protective layers on semiconductor device compo...
- Publication number 20040198023
- Publication date Oct 7, 2004
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protective layers formed on semiconductor device components so as t...
- Publication number 20040183210
- Publication date Sep 23, 2004
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20030205790
- Publication date Nov 6, 2003
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials and method of manuf...
- Publication number 20020076857
- Publication date Jun 20, 2002
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS

S. Derek Hinkle

Person

Patents Grantslast 30 patents

Multi-part lead frame

Semiconductor device structures including protective layers formed...

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials and method of manuf...

Protective layers formed on semiconductor device components so as t...

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials and method of manuf...

Multi-part lead frame with dissimilar materials and method of manuf...

Multi-part lead frame with dissimilar materials and method of manuf...

Patents Applicationslast 30 patents

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Semiconductor device structures including protective layers formed...

Multi-part lead frame with dissimilar materials

Methods for forming protective layers on semiconductor device compo...

Protective layers formed on semiconductor device components so as t...

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials and method of manuf...