Sa-Lly Liu

Person

Hsin Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit designs based on temperature distribution determ...
- Patent number 10,289,777
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sa-Lly Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual-band band-pass filters and method of use
- Patent number 10,027,304
- Issue date Jul 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Hsien Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
On-chip electromagnetic bandgap (EBG) structure for noise suppression
- Patent number 9,899,982
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Hsien Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
De-embedding on-wafer devices
- Patent number 9,658,275
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional circuit including shielded inductor and method of...
- Patent number 9,548,267
- Issue date Jan 17, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Hsien Tsai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Contactless communications using ferromagnetic material
- Patent number 9,412,721
- Issue date Aug 9, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Lin Yang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electromagnetic bandgap structure for three dimensional ICS
- Patent number 9,355,960
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsieh-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
De-embedding on-wafer devices
- Patent number 9,103,884
- Issue date Aug 11, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional circuit including shielded inductor and method of...
- Patent number 9,048,127
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC configuration with contactless communication
- Patent number 8,921,160
- Issue date Dec 30, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tool and method for modeling interposer RC couplings
- Patent number 8,856,710
- Issue date Oct 7, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yang Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contactless communications using ferromagnetic material
- Patent number 8,760,255
- Issue date Jun 24, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Lin Yang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
3D IC configuration with contactless communication
- Patent number 8,513,795
- Issue date Aug 20, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL-BAND BAND-PASS FILTERS AND METHOD OF USE
- Publication number 20170331443
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Hsien TSAI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ON-CHIP ELECTROMAGNETIC BANDGAP (EBG) STRUCTURE FOR NOISE SUPPRESSION
- Publication number 20170149404
- Publication date May 25, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TEMPERATURE DISTRIBUTION DETERMINATION
- Publication number 20150370937
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sa-Lly LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
De-Embedding On-Wafer Devices
- Publication number 20150316603
- Publication date Nov 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE FOR THREE DIMENSIONAL ICS
- Publication number 20150311159
- Publication date Oct 29, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsieh-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL CIRCUIT INCLUDING SHIELDED INDUCTOR AND METHOD OF...
- Publication number 20150249051
- Publication date Sep 3, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming Hsien TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL CIRCUIT INCLUDING SHIELDED INDUCTOR AND METHOD OF...
- Publication number 20150084158
- Publication date Mar 26, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL
- Publication number 20140256063
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Ping-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC CONFIGURATION WITH CONTACTLESS COMMUNICATION
- Publication number 20130302942
- Publication date Nov 14, 2013
- Ping-Lin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC CONFIGURATION WITH CONTACTLESS COMMUNICATION
- Publication number 20130161811
- Publication date Jun 27, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Ping-Lin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL
- Publication number 20130038418
- Publication date Feb 14, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Ping-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOL AND METHOD FOR MODELING INTERPOSER RC COUPLINGS
- Publication number 20130007692
- Publication date Jan 3, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Yang Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DE-EMBEDDING ON-WAFER DEVICES
- Publication number 20120146680
- Publication date Jun 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Integrated circuit designs based on temperature distribution determ...

Dual-band band-pass filters and method of use

On-chip electromagnetic bandgap (EBG) structure for noise suppression

De-embedding on-wafer devices

Three dimensional circuit including shielded inductor and method of...

Contactless communications using ferromagnetic material

Electromagnetic bandgap structure for three dimensional ICS

De-embedding on-wafer devices

Three dimensional circuit including shielded inductor and method of...

3D IC configuration with contactless communication

Tool and method for modeling interposer RC couplings

Contactless communications using ferromagnetic material

3D IC configuration with contactless communication

Patents Applicationslast 30 patents

DUAL-BAND BAND-PASS FILTERS AND METHOD OF USE

ON-CHIP ELECTROMAGNETIC BANDGAP (EBG) STRUCTURE FOR NOISE SUPPRESSION

INTEGRATED CIRCUIT TEMPERATURE DISTRIBUTION DETERMINATION

De-Embedding On-Wafer Devices

ELECTROMAGNETIC BANDGAP STRUCTURE FOR THREE DIMENSIONAL ICS

THREE DIMENSIONAL CIRCUIT INCLUDING SHIELDED INDUCTOR AND METHOD OF...

THREE DIMENSIONAL CIRCUIT INCLUDING SHIELDED INDUCTOR AND METHOD OF...

CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL

3D IC CONFIGURATION WITH CONTACTLESS COMMUNICATION

3D IC CONFIGURATION WITH CONTACTLESS COMMUNICATION

CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL

TOOL AND METHOD FOR MODELING INTERPOSER RC COUPLINGS

DE-EMBEDDING ON-WAFER DEVICES