Sa-Yoon Kang

Person

Dongjak-gu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 9,570,400
- Issue date Feb 14, 2017
- Samsung Electronics Co., Ltd.
- Bo-Na Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on flexible printed circuit type semiconductor package
- Patent number 8,575,746
- Issue date Nov 5, 2013
- Samsung Electronics Co., Ltd.
- Si-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing tape wiring board
- Patent number 8,250,750
- Issue date Aug 28, 2012
- Samsung Electronics Co., Ltd.
- Kyoung-Sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 8,222,089
- Issue date Jul 17, 2012
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display driver integrated circuit device, film, and module
- Patent number 7,999,341
- Issue date Aug 16, 2011
- Samsung Electronics Co., Ltd.
- Ye-chung Chung
- G02 - OPTICS
Information Patent Grant
Tape circuit substrate with reduced size of base film
- Patent number 7,948,768
- Issue date May 24, 2011
- Samsung Electronics Co., Ltd.
- Sang-Ho Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 7,915,727
- Issue date Mar 29, 2011
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
TAB package connecting host device element
- Patent number 7,902,647
- Issue date Mar 8, 2011
- Samsung Electronics Co., Ltd.
- Ye-chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing tape wiring board
- Patent number 7,895,742
- Issue date Mar 1, 2011
- Samsung Electronics Co., Ltd.
- Kyoung-Sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip and TAB package having the same
- Patent number 7,732,933
- Issue date Jun 8, 2010
- Samsung Electronics Co., Ltd.
- Ye-Chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display driver integrated circuit device, film, and module
- Patent number 7,683,471
- Issue date Mar 23, 2010
- Samsung Electronics Co., Ltd.
- Ye-chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package film having reinforcing member and related di...
- Patent number 7,683,476
- Issue date Mar 23, 2010
- Samsung Electronics Co., Ltd.
- Si-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab package connecting host device element
- Patent number 7,649,246
- Issue date Jan 19, 2010
- Samsung Electronics Co., Ltd.
- Ye-chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape circuit substrate with reduced size of base film
- Patent number 7,599,193
- Issue date Oct 6, 2009
- Samsung Electronics Co., Ltd.
- Sang-Ho Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup device with non-molded DSP chip and manufacturing method
- Patent number 7,405,760
- Issue date Jul 29, 2008
- Samsung Electronics Co., Ltd.
- Min Kyo Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package
- Patent number 7,375,426
- Issue date May 20, 2008
- Samsung Electronics Co., Ltd.
- Suk-Chae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape circuit substrate and semiconductor apparatus employing the same
- Patent number 7,339,262
- Issue date Mar 4, 2008
- Samsung Electronics Co., Ltd.
- Dae-Woo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip and tab package having the same
- Patent number 7,329,597
- Issue date Feb 12, 2008
- Samsung Electronics Co., Ltd.
- Ye-Chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-board package having flip chip assembly structure and manuf...
- Patent number 7,315,086
- Issue date Jan 1, 2008
- Samsung Electronics Co., Ltd.
- Dong-Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for its manufacture
- Patent number 7,309,916
- Issue date Dec 18, 2007
- Samsung Electronics Co., Ltd.
- Suk-Chae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing tape wiring board
- Patent number 7,299,547
- Issue date Nov 27, 2007
- Samsung Electronics Co., Ltd.
- Kyoung-Sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip, chip stack package and manufacturing method
- Patent number 7,208,343
- Issue date Apr 24, 2007
- Samsung Electronics Co., Ltd.
- Young Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit film with bump, film package using the same, and related fa...
- Patent number 7,190,073
- Issue date Mar 13, 2007
- Samsung Electronics Co., Ltd.
- Yong-Hwan Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape circuit substrate and semicondutor chip package using the same
- Patent number 7,183,660
- Issue date Feb 27, 2007
- Samsung Electronics Co., Ltd.
- Si-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package having upper chip provided with trenches and m...
- Patent number 7,115,483
- Issue date Oct 3, 2006
- Samsung Electronics Co., Ltd.
- Yong Hwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost flexible film package module and method of manufacturing t...
- Patent number 7,109,575
- Issue date Sep 19, 2006
- Samsung Electronics Co., Ltd.
- Sa-Yoon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming redistribution bump and semiconductor chip and mo...
- Patent number 7,078,331
- Issue date Jul 18, 2006
- Samsung Electronics Co., Ltd.
- Yong-Hwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump formed on semiconductor device chip and method for manufacturi...
- Patent number 7,074,704
- Issue date Jul 11, 2006
- Samsung Electronics Co., Ltd.
- Yong-hwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale packages manufactured at wafer level
- Patent number 6,903,451
- Issue date Jun 7, 2005
- Samsung Electronics Co., Ltd.
- Nam Seog Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding a flexible printed circuit cable t...
- Patent number 6,902,261
- Issue date Jun 7, 2005
- Samsung Electronics Co., Ltd.
- Jeong-seon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150318226
- Publication date Nov 5, 2015
- Samsung Electronics Co., Ltd.
- Bo-Na BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...
- Publication number 20110143625
- Publication date Jun 16, 2011
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING TAPE WIRING BOARD
- Publication number 20110119912
- Publication date May 26, 2011
- Kyoung-Sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tape circuit substrate with reduced size of base film
- Publication number 20100149775
- Publication date Jun 17, 2010
- Sang-Ho Park
- G02 - OPTICS
Information Patent Application
DISPLAY DRIVER INTEGRATED CIRCUIT DEVICE, FILM, AND MODULE
- Publication number 20100141617
- Publication date Jun 10, 2010
- Samsung Electronics Co., Ltd.
- Ye-chung CHUNG
- G02 - OPTICS
Information Patent Application
TAB PACKAGE CONNECTING HOST DEVICE ELEMENT
- Publication number 20100072607
- Publication date Mar 25, 2010
- Ye-chung Chung
- G02 - OPTICS
Information Patent Application
Tape for heat dissipating member, chip on film type semiconductor p...
- Publication number 20090273076
- Publication date Nov 5, 2009
- Kyong-sei CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP AND TAB PACKAGE HAVING THE SAME
- Publication number 20080128902
- Publication date Jun 5, 2008
- Samsung Electronics Co., Ltd.
- Ye-Chung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-BOARD PACKAGE HAVING FLIP CHIP ASSEMBLY STRUCTURE AND MANUF...
- Publication number 20080081456
- Publication date Apr 3, 2008
- Samsung Electronics Co., Ltd.
- Dong-Han KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING TAPE WIRING BOARD
- Publication number 20080029923
- Publication date Feb 7, 2008
- Samsung Electronics Co., Ltd.
- Kyoung-Sei CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip on flexible printed circuit type semiconductor package
- Publication number 20080023822
- Publication date Jan 31, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Si-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT FILM WITH BUMP, FILM PACKAGE USING THE SAME, AND RELATED FA...
- Publication number 20070126110
- Publication date Jun 7, 2007
- Samsung Electronics Co., Ltd.
- Yong-Hwan KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package film having reinforcing member and related di...
- Publication number 20070057360
- Publication date Mar 15, 2007
- Si-hoon Lee
- G02 - OPTICS
Information Patent Application
Display driver integrated circuit device, film, and module
- Publication number 20070013857
- Publication date Jan 18, 2007
- Ye-chung Chung
- G02 - OPTICS
Information Patent Application
Low-cost flexible film package module and method of manufacturing t...
- Publication number 20060268213
- Publication date Nov 30, 2006
- Sa-Yoon Kang
- G02 - OPTICS
Information Patent Application
Tab package connecting host device element
- Publication number 20060267164
- Publication date Nov 30, 2006
- Ye-chung Chung
- G02 - OPTICS
Information Patent Application
METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MO...
- Publication number 20060202334
- Publication date Sep 14, 2006
- Samsung Electronics Co., Ltd.
- Yong-Hwan KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and tab package having the same
- Publication number 20060113648
- Publication date Jun 1, 2006
- Ye-Chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-on-board package having flip chip assembly structure and manuf...
- Publication number 20060091511
- Publication date May 4, 2006
- Dong-Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film circuit substrate having Sn-In alloy layer
- Publication number 20060091504
- Publication date May 4, 2006
- Un-Byoung Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Camera module and method of fabricating the same
- Publication number 20060082673
- Publication date Apr 20, 2006
- Dong-Han Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Film substrate of a semiconductor package and a manufacturing method
- Publication number 20060071303
- Publication date Apr 6, 2006
- Chung-Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method for its manufacture
- Publication number 20060012026
- Publication date Jan 19, 2006
- Suk-Chae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20060012019
- Publication date Jan 19, 2006
- Samsung Electronics Co., Ltd.
- Suk-Chae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing tape wiring board
- Publication number 20060003568
- Publication date Jan 5, 2006
- Kyoung-Sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit film with bump, film package using the same, and related fa...
- Publication number 20050285277
- Publication date Dec 29, 2005
- Yong-Hwan Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing tape wiring substrate
- Publication number 20050205524
- Publication date Sep 22, 2005
- Chung-Sun Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Tape circuit substrate with reduced size of base film
- Publication number 20050121796
- Publication date Jun 9, 2005
- Sang-Ho Park
- G02 - OPTICS
Information Patent Application
Semiconductor chip, tape carrier package having the same mounted th...
- Publication number 20050110935
- Publication date May 26, 2005
- Dong-Han Kim
- G02 - OPTICS
Information Patent Application
Semiconductor chip, chip stack package and manufacturing method
- Publication number 20050101056
- Publication date May 12, 2005
- Young Hee Song
- H01 - BASIC ELECTRIC ELEMENTS

Sa-Yoon Kang

Person

Patents Grantslast 30 patents

Semiconductor package

Chip on flexible printed circuit type semiconductor package

Method for manufacturing tape wiring board

Tape for heat dissipating member, chip on film type semiconductor p...

Display driver integrated circuit device, film, and module

Tape circuit substrate with reduced size of base film

Tape for heat dissipating member, chip on film type semiconductor p...

TAB package connecting host device element

Method for manufacturing tape wiring board

Semiconductor chip and TAB package having the same

Display driver integrated circuit device, film, and module

Semiconductor package film having reinforcing member and related di...

Tab package connecting host device element

Tape circuit substrate with reduced size of base film

Image pickup device with non-molded DSP chip and manufacturing method

Semiconductor package

Tape circuit substrate and semiconductor apparatus employing the same

Semiconductor chip and tab package having the same

Chip-on-board package having flip chip assembly structure and manuf...

Semiconductor package and method for its manufacture

Method for manufacturing tape wiring board

Semiconductor chip, chip stack package and manufacturing method

Circuit film with bump, film package using the same, and related fa...

Tape circuit substrate and semicondutor chip package using the same

Stacked chip package having upper chip provided with trenches and m...

Low-cost flexible film package module and method of manufacturing t...

Method of forming redistribution bump and semiconductor chip and mo...

Bump formed on semiconductor device chip and method for manufacturi...

Chip scale packages manufactured at wafer level

Method and apparatus for bonding a flexible printed circuit cable t...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...

METHOD FOR MANUFACTURING TAPE WIRING BOARD

Tape circuit substrate with reduced size of base film

DISPLAY DRIVER INTEGRATED CIRCUIT DEVICE, FILM, AND MODULE

TAB PACKAGE CONNECTING HOST DEVICE ELEMENT

Tape for heat dissipating member, chip on film type semiconductor p...

SEMICONDUCTOR CHIP AND TAB PACKAGE HAVING THE SAME

CHIP-ON-BOARD PACKAGE HAVING FLIP CHIP ASSEMBLY STRUCTURE AND MANUF...

METHOD FOR MANUFACTURING TAPE WIRING BOARD

Chip on flexible printed circuit type semiconductor package

CIRCUIT FILM WITH BUMP, FILM PACKAGE USING THE SAME, AND RELATED FA...

Semiconductor package film having reinforcing member and related di...

Display driver integrated circuit device, film, and module

Low-cost flexible film package module and method of manufacturing t...

Tab package connecting host device element

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MO...

Semiconductor chip and tab package having the same

Chip-on-board package having flip chip assembly structure and manuf...

Film circuit substrate having Sn-In alloy layer

Camera module and method of fabricating the same

Film substrate of a semiconductor package and a manufacturing method

Semiconductor package and method for its manufacture

Semiconductor package

Method for manufacturing tape wiring board

Circuit film with bump, film package using the same, and related fa...

Method of manufacturing tape wiring substrate

Tape circuit substrate with reduced size of base film

Semiconductor chip, tape carrier package having the same mounted th...

Semiconductor chip, chip stack package and manufacturing method