Saat Shukri Embong

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Terrengganu, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing an electronic device package
- Patent number 6,588,098
- Issue date Jul 8, 2003
- Semiconductor Components Industries LLC
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-less clip bonding
- Patent number 6,479,893
- Issue date Nov 12, 2002
- Semiconductor Components Industries LLC
- Saat Shukri Embong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component and semiconductor...
- Patent number 6,475,834
- Issue date Nov 5, 2002
- Semiconductor Components Industries LLC
- Saat Shukri Embong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package on a leadframe
- Patent number 6,436,736
- Issue date Aug 20, 2002
- Semiconductor Components Industries LLC
- Saat Shukri Embong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for forming same
- Patent number 6,376,266
- Issue date Apr 23, 2002
- Semiconductor Components Industries LLC
- James Price Letterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, method of manufacturing a leadframe, and method of packa...
- Patent number 5,973,388
- Issue date Oct 26, 1999
- Motorola, Inc.
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ball-less clip bonding
- Publication number 20020066963
- Publication date Jun 6, 2002
- Semiconductor Components Industries, LLC.
- Saat Shukri Embong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor component and semiconductor...
- Publication number 20020066962
- Publication date Jun 6, 2002
- Semiconductor Components Industries, LLC.
- Saat Shukri Embong
- H01 - BASIC ELECTRIC ELEMENTS