Saburo Miyamoto

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive tape joining method and adhesive tape joining apparatus
- Patent number 8,349,106
- Issue date Jan 8, 2013
- Nitto Denko Corporation
- Saburo Miyamoto
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Protective tape separation method and protective tape separation ap...
- Patent number 8,097,121
- Issue date Jan 17, 2012
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Protective tape separation method and apparatus using the same
- Patent number 8,062,474
- Issue date Nov 22, 2011
- Nitto Denko Corporation
- Masayuki Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Adhesive tape cutting method and adhesive tape joining apparatus us...
- Patent number 7,984,737
- Issue date Jul 26, 2011
- Nitto Denko Corporation
- Masayuki Yamamoto
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Adhesive tape joining apparatus
- Patent number 7,913,735
- Issue date Mar 29, 2011
- Nitto Denko Corporation
- Masayuki Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for joining a separating adhesive tape
- Patent number 7,849,900
- Issue date Dec 14, 2010
- Nitto Denko Corporation
- Saburo Miyamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for separating semiconductor wafer from supporting member, a...
- Patent number 7,393,757
- Issue date Jul 1, 2008
- Nitto Denko Corporation
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing semiconductor wafer into chips, and apparatus usin...
- Patent number 7,387,951
- Issue date Jun 17, 2008
- Nitto Denko Corporation
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating semiconductor wafer, and separating apparatus...
- Patent number 7,384,811
- Issue date Jun 10, 2008
- Nitto Denko Corporation
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate joining apparatus
- Patent number 7,078,316
- Issue date Jul 18, 2006
- Nitto Denko Corporation
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist removing apparatus and method
- Patent number 6,235,144
- Issue date May 22, 2001
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resist removing method
- Patent number 6,099,675
- Issue date Aug 8, 2000
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for peeling protective adhesive tape from semi...
- Patent number 5,891,298
- Issue date Apr 6, 1999
- Nitto Denko Corporation
- Shigeji Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer loading and unloading apparatus, and semiconduc...
- Patent number 5,759,006
- Issue date Jun 2, 1998
- Nitto Denko Corporation
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Taping machine
- Patent number 4,204,905
- Issue date May 27, 1980
- Nitto Denki Kogyo Kabushiki Kaisha (Nitto Electric Industrial Co., Ltd.)
- Saburo Miyamoto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
MOUNTED WAFER MANUFACTURING METHOD
- Publication number 20120160397
- Publication date Jun 28, 2012
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTIN...
- Publication number 20110232841
- Publication date Sep 29, 2011
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS
- Publication number 20110056615
- Publication date Mar 10, 2011
- Saburo Miyamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS
- Publication number 20110048609
- Publication date Mar 3, 2011
- Saburo Miyamoto
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD AND CONFIGURATION FOR REINFORCING PLATE MATERIAL
- Publication number 20110045234
- Publication date Feb 24, 2011
- Saburo Miyamoto
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
METHOD AND APPARATUS FOR JOINING PROTECTIVE TAPE TO SEMICONDUCTOR W...
- Publication number 20100038009
- Publication date Feb 18, 2010
- Chouhei Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE JOINING APPARATUS
- Publication number 20090211710
- Publication date Aug 27, 2009
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE TAPE SEPARATION METHOD AND APPARATUS USING THE SAME
- Publication number 20090090451
- Publication date Apr 9, 2009
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE TAPE SEPARATION METHOD AND PROTECTIVE TAPE SEPARATION AP...
- Publication number 20090065144
- Publication date Mar 12, 2009
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Adhesive tape cutting method and adhesive tape joining apparatus us...
- Publication number 20080066869
- Publication date Mar 20, 2008
- Nitto Denko Corporation
- Masayuki Yamamoto
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Protective tape separating method and apparatus using the same
- Publication number 20060219359
- Publication date Oct 5, 2006
- NITTO DENKO CORPORATION
- Saburo Miyamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of dicing semiconductor wafer into chips, and apparatus usin...
- Publication number 20050215033
- Publication date Sep 29, 2005
- NITTO DENKO CORPORATION
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of separating semiconductor wafer, and separating apparatus...
- Publication number 20050074952
- Publication date Apr 7, 2005
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for separating semiconductor wafer from supporting member, a...
- Publication number 20050032332
- Publication date Feb 10, 2005
- Saburo Miyamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Substrate joining method and apparatus
- Publication number 20050014345
- Publication date Jan 20, 2005
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS

Saburo Miyamoto

Person

Patents Grantslast 30 patents

Adhesive tape joining method and adhesive tape joining apparatus

Protective tape separation method and protective tape separation ap...

Protective tape separation method and apparatus using the same

Adhesive tape cutting method and adhesive tape joining apparatus us...

Adhesive tape joining apparatus

Apparatus for joining a separating adhesive tape

Method for separating semiconductor wafer from supporting member, a...

Method of dicing semiconductor wafer into chips, and apparatus usin...

Method of separating semiconductor wafer, and separating apparatus...

Substrate joining apparatus

Resist removing apparatus and method

Resist removing method

Method and apparatus for peeling protective adhesive tape from semi...

Semiconductor wafer loading and unloading apparatus, and semiconduc...

Taping machine

Patents Applicationslast 30 patents

MOUNTED WAFER MANUFACTURING METHOD

SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTIN...

ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS

ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS

METHOD AND CONFIGURATION FOR REINFORCING PLATE MATERIAL

METHOD AND APPARATUS FOR JOINING PROTECTIVE TAPE TO SEMICONDUCTOR W...

ADHESIVE TAPE JOINING APPARATUS

PROTECTIVE TAPE SEPARATION METHOD AND APPARATUS USING THE SAME

PROTECTIVE TAPE SEPARATION METHOD AND PROTECTIVE TAPE SEPARATION AP...

Adhesive tape cutting method and adhesive tape joining apparatus us...

Protective tape separating method and apparatus using the same

Method of dicing semiconductor wafer into chips, and apparatus usin...

Method of separating semiconductor wafer, and separating apparatus...

Method for separating semiconductor wafer from supporting member, a...

Substrate joining method and apparatus