Sachiko Oda

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and electronic device
- Patent number 10,790,236
- Issue date Sep 29, 2020
- Shinko Electric Industries Co., Ltd.
- Sachiko Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump forming method
- Patent number 7,807,560
- Issue date Oct 5, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a circuit substrate and method of manufactu...
- Patent number 7,435,680
- Issue date Oct 14, 2008
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20190311990
- Publication date Oct 10, 2019
- Shinko Electric Industries Co., Ltd.
- Sachiko ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20190067199
- Publication date Feb 28, 2019
- Shinko Electric Industries Co., Ltd.
- Daisuke Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMING METHOD
- Publication number 20090023281
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pad structure of wiring board and wiring board
- Publication number 20060209497
- Publication date Sep 21, 2006
- Kazuhiko Ooi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing a circuit substrate and method of manufactu...
- Publication number 20060121719
- Publication date Jun 8, 2006
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR