Sachin Deshmukh

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package with partial integrated heat spreader
- Patent number 11,004,768
- Issue date May 11, 2021
- Intel Corporation
- Muhammad S. Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoff spacers for managing bondline thickness in microelectronic...
- Patent number 10,643,938
- Issue date May 5, 2020
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER
- Publication number 20210035886
- Publication date Feb 4, 2021
- Intel Corporation
- Muhammad S. Islam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC...
- Publication number 20180350712
- Publication date Dec 6, 2018
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS