Sachin Deshpande

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Real-time parameter tuning for etch processes
- Patent number 7,801,635
- Issue date Sep 21, 2010
- Tokyo Electron Limited
- Merritt Funk
- G05 - CONTROLLING REGULATING
Information Patent Grant
Real-time parameter tuning using wafer thickness
- Patent number 7,642,102
- Issue date Jan 5, 2010
- Tokyo Electron Limited
- Merritt Funk
- G01 - MEASURING TESTING
Information Patent Grant
Method of using a wafer-thickness-dependant profile library
- Patent number 7,571,074
- Issue date Aug 4, 2009
- Tokyo Electron Limited
- Merritt Funk
- G01 - MEASURING TESTING
Information Patent Grant
Real-time parameter tuning using wafer temperature
- Patent number 7,517,708
- Issue date Apr 14, 2009
- Tokyo Electron Limited
- Sachin Deshpande
- G01 - MEASURING TESTING
Information Patent Grant
Parallel profile determination in optical metrology
- Patent number 7,515,283
- Issue date Apr 7, 2009
- Tokyo Electron, Ltd.
- Tri Thanh Khuong
- G01 - MEASURING TESTING
Information Patent Grant
Parallel profile determination for an optical metrology system
- Patent number 7,469,192
- Issue date Dec 23, 2008
- Tokyo Electron Ltd.
- Tri Thanh Khuong
- G01 - MEASURING TESTING
Information Patent Grant
Method of using a wafer-temperature-dependent profile library
- Patent number 7,451,054
- Issue date Nov 11, 2008
- Tokyo Electron Limited
- Sachin Deshpande
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Real-Time Parameter Tuning For Etch Processes
- Publication number 20080183312
- Publication date Jul 31, 2008
- TOKYO ELECTRON LIMITED
- Merritt Funk
- G05 - CONTROLLING REGULATING
Information Patent Application
Method of Using a Wafer-Thickness-Dependant Profile Library
- Publication number 20080183411
- Publication date Jul 31, 2008
- TOKYO ELECTRON LIMITED
- Merritt Funk
- G01 - MEASURING TESTING
Information Patent Application
Real-Time Parameter Tuning Using Wafer Thickness
- Publication number 20080183412
- Publication date Jul 31, 2008
- TOKYO ELECTRON LIMITED
- Merritt Funk
- G01 - MEASURING TESTING
Information Patent Application
Real-Time Parameter Tuning Using Wafer Temperature
- Publication number 20080182343
- Publication date Jul 31, 2008
- TOKYO ELECTRON LIMITED
- Sachin Deshpande
- G01 - MEASURING TESTING
Information Patent Application
Method of Using a Wafer-Temperature-Dependant Profile Library
- Publication number 20080183413
- Publication date Jul 31, 2008
- TOKYO ELECTRON LIMITED
- Sachin Deshpande
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Parallel profile determination for an optical metrology system
- Publication number 20080015812
- Publication date Jan 17, 2008
- TOKYO ELECTRON LIMITED
- Tri Thanh Khuong
- G01 - MEASURING TESTING
Information Patent Application
Parallel profile determination in optical metrology
- Publication number 20080013108
- Publication date Jan 17, 2008
- TOKYO ELECTRON LIMITED
- Tri Thanh Khuong
- G01 - MEASURING TESTING

Sachin Deshpande

Person

Patents Grantslast 30 patents

Real-time parameter tuning for etch processes

Real-time parameter tuning using wafer thickness

Method of using a wafer-thickness-dependant profile library

Real-time parameter tuning using wafer temperature

Parallel profile determination in optical metrology

Parallel profile determination for an optical metrology system

Method of using a wafer-temperature-dependent profile library

Patents Applicationslast 30 patents

Real-Time Parameter Tuning For Etch Processes

Method of Using a Wafer-Thickness-Dependant Profile Library

Real-Time Parameter Tuning Using Wafer Thickness

Real-Time Parameter Tuning Using Wafer Temperature

Method of Using a Wafer-Temperature-Dependant Profile Library

Parallel profile determination for an optical metrology system

Parallel profile determination in optical metrology