Sachio Tamura

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a package-type semiconductor assembly
- Patent number 5,151,118
- Issue date Sep 29, 1992
- Kabushiki Kaisha Goto Seisakusho
- Tadao Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS