TREA

Sada Hiroyuki

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  • Beppu City, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Laser dicing for singulation
    • Patent number 12,198,982
    • Issue date Jan 14, 2025
    • Texas Instruments Incorporated
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Subring for semiconductor dies
    • Patent number 11,482,442
    • Issue date Oct 25, 2022
    • Texas Instruments Incorporated
    • Matthew John Sherbin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laser dicing for singulation
    • Patent number 11,469,141
    • Issue date Oct 11, 2022
    • Texas Instruments Incorporated
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die matrix expander with partitioned subring
    • Patent number 11,171,031
    • Issue date Nov 9, 2021
    • Texas Instruments Incorporated
    • Matthew John Sherbin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor die singulation
    • Patent number 10,658,240
    • Issue date May 19, 2020
    • Texas Instruments Incorporated
    • Shoichi Iriguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER DICING FOR SINGULATION
    • Publication number 20230040267
    • Publication date Feb 9, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBRING FOR SEMICONDUCTOR DIES
    • Publication number 20210183683
    • Publication date Jun 17, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Matthew John Sherbin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBRING FOR SEMICONDUCTOR DIES
    • Publication number 20200075386
    • Publication date Mar 5, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Matthew John Sherbin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER DICING FOR SINGULATION
    • Publication number 20200051860
    • Publication date Feb 13, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE MATRIX EXPANDER WITH PARTITIONED SUBRING
    • Publication number 20200027772
    • Publication date Jan 23, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • MATTHEW JOHN SHERBIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR WAFER PROCESSING
    • Publication number 20130264686
    • Publication date Oct 10, 2013
    • TEXAS INSTRUMENTS INCORPORATED
    • Iriguchi Shoichi
    • H01 - BASIC ELECTRIC ELEMENTS