Sadahito Misumi

Person

Ibarkai-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive sheet for manufacturing semiconductor device, manufacturin...
- Patent number 9,153,556
- Issue date Oct 6, 2015
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film, method of manufacturing semiconductor device, and se...
- Patent number 9,105,754
- Issue date Aug 11, 2015
- Nitto Denko Corporation
- Yuichiro Shishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device, adhesive sheet used t...
- Patent number 8,975,759
- Issue date Mar 10, 2015
- Nitto Denko Corporation
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode element in which an optical semiconductor elem...
- Patent number 8,890,190
- Issue date Nov 18, 2014
- Nitto Denko Corporation
- Hisataka Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,703,584
- Issue date Apr 22, 2014
- Nitto Denko Corporation
- Sadahito Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing light-emitting diode device
- Patent number 8,642,362
- Issue date Feb 4, 2014
- Nitto Denko Corporation
- Hisataka Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a semiconductor device
- Patent number 8,592,260
- Issue date Nov 26, 2013
- Nitto Denko Corporation
- Masami Oikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting die-bonding film
- Patent number 8,580,617
- Issue date Nov 12, 2013
- Nitto Denko Corporation
- Yuki Sugo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing die-bonding film
- Patent number 8,304,341
- Issue date Nov 6, 2012
- Nitto Denko Corporation
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Manufacturing method of semiconductor device, adhesive sheet used t...
- Patent number 8,278,153
- Issue date Oct 2, 2012
- Nitto Denko Corporation
- Sadahito Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,236,614
- Issue date Aug 7, 2012
- Nitto Denko Corporation
- Sadahito Misumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting die-bonding film
- Patent number 8,143,106
- Issue date Mar 27, 2012
- Nitto Denko Corporation
- Yuki Sugo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing/die bonding film
- Patent number 7,998,552
- Issue date Aug 16, 2011
- Nittok Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing die-bonding film
- Patent number 7,863,182
- Issue date Jan 4, 2011
- Nitto Denko Corporation
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing die-bonding film, method of fixing chipped work and semicond...
- Patent number 7,780,811
- Issue date Aug 24, 2010
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device, adhesive sheet used t...
- Patent number 7,772,040
- Issue date Aug 10, 2010
- Nitto Denko Corporation
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting die bonding film
- Patent number 7,611,926
- Issue date Nov 3, 2009
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film material for use in manufacturing semiconductors
- Patent number D589473
- Issue date Mar 31, 2009
- Nitto Denko Corporation
- Naohide Takamoto
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Dicing die-bonding film
- Patent number 7,508,081
- Issue date Mar 24, 2009
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die-bonding film, method of fixing chipped work and semicond...
- Patent number 7,449,226
- Issue date Nov 11, 2008
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die-bonding film
- Patent number D549189
- Issue date Aug 21, 2007
- Nitto Denko Corporation
- Sadahito Misumi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Process for producing a semiconductor device
- Patent number 7,232,709
- Issue date Jun 19, 2007
- Nitto Denko Corporation
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery separator containing carbodiimide polymer
- Patent number 6,896,994
- Issue date May 24, 2005
- Nitto Denko Corporation
- Masakatsu Urairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery containing a polycarbodiimide polymer
- Patent number 6,811,927
- Issue date Nov 2, 2004
- Nitto Denko Corporation
- Masakatsu Urairi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Anisotropic conductive film
- Patent number 6,669,869
- Issue date Dec 30, 2003
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor wafer with adhesive film
- Patent number 6,652,688
- Issue date Nov 25, 2003
- Nitto Denko Corporation
- Akiko Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycarbodiimide
- Patent number 6,492,484
- Issue date Dec 10, 2002
- Nitto Denko Corporation
- Sadahito Misumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Aromatic polycarbodiimide and sheet thereof
- Patent number 6,414,105
- Issue date Jul 2, 2002
- Nitto Denko Corporation
- Sadahito Misumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor sealing epoxy resin composition and semiconductor dev...
- Patent number 6,410,615
- Issue date Jun 25, 2002
- Nitto Denko Corporation
- Takashi Taniguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Aromatic polycarbodiimide and polycarbodiimide sheet
- Patent number 6,248,857
- Issue date Jun 19, 2001
- Nitto Denko Corporation
- Sadahito Misumi
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SE...
- Publication number 20140001654
- Publication date Jan 2, 2014
- Yuichiro Shishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...
- Publication number 20130020724
- Publication date Jan 24, 2013
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE ELEMENT AND LIGHT-EMITTING DIODE DEVICE
- Publication number 20120217527
- Publication date Aug 30, 2012
- Nitto Denko Corporation
- Hisataka ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING LIGHT-EMITTING DIODE DEVICE
- Publication number 20120220059
- Publication date Aug 30, 2012
- Nitto Denko Corporation
- Hisataka ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20120189845
- Publication date Jul 26, 2012
- Sadahito Misumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20120135242
- Publication date May 31, 2012
- Yuki SUGO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING DIE-BONDING FILM
- Publication number 20110147952
- Publication date Jun 23, 2011
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE
- Publication number 20100330745
- Publication date Dec 30, 2010
- Masami Oikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20100301497
- Publication date Dec 2, 2010
- Nitto Denko Corporation
- Sadahito MISUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...
- Publication number 20100264531
- Publication date Oct 21, 2010
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICOND...
- Publication number 20100236689
- Publication date Sep 23, 2010
- NITTO DENKO CORPORATION
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100219507
- Publication date Sep 2, 2010
- Sadahito Misumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...
- Publication number 20100197080
- Publication date Aug 5, 2010
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING/DIE BONDING FILM
- Publication number 20100093154
- Publication date Apr 15, 2010
- Nitto Denko Corporation
- Yasuhiro Amano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING/DIE BONDING FILM
- Publication number 20100019365
- Publication date Jan 28, 2010
- NITTO DENKO CORPORATION
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING DIE-BONDING FILM
- Publication number 20090149003
- Publication date Jun 11, 2009
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20090032976
- Publication date Feb 5, 2009
- Sadahito Misumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...
- Publication number 20090001611
- Publication date Jan 1, 2009
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING DIE BONDING FILM
- Publication number 20080213943
- Publication date Sep 4, 2008
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...
- Publication number 20080064141
- Publication date Mar 13, 2008
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICOND...
- Publication number 20070137782
- Publication date Jun 21, 2007
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing die-bonding film
- Publication number 20050208736
- Publication date Sep 22, 2005
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for producing a semiconductor device
- Publication number 20050156321
- Publication date Jul 21, 2005
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing die-bonding film, method of fixing chipped work and semicond...
- Publication number 20040241910
- Publication date Dec 2, 2004
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesives composition, adhesive film, and semiconductor apparatus u...
- Publication number 20040230000
- Publication date Nov 18, 2004
- Sadahito Misumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process of producing semiconductor device and resin composition she...
- Publication number 20030068841
- Publication date Apr 10, 2003
- NITTO DENKO CORPORATION
- Akiko Matsumura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for producing semiconductor wafer with adhesive film
- Publication number 20030034128
- Publication date Feb 20, 2003
- NITTO DENKO CORPORATION
- Akiko Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separator for battery
- Publication number 20020172870
- Publication date Nov 21, 2002
- Masakatsu Urairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic conductive film
- Publication number 20020130302
- Publication date Sep 19, 2002
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polycarbodiimide
- Publication number 20020055606
- Publication date May 9, 2002
- Sadahito Misumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Sadahito Misumi

Person

Patents Grantslast 30 patents

Adhesive sheet for manufacturing semiconductor device, manufacturin...

Adhesive film, method of manufacturing semiconductor device, and se...

Manufacturing method of semiconductor device, adhesive sheet used t...

Light-emitting diode element in which an optical semiconductor elem...

Dicing tape-integrated film for semiconductor back surface

Method for producing light-emitting diode device

Process for producing a semiconductor device

Thermosetting die-bonding film

Dicing die-bonding film

Manufacturing method of semiconductor device, adhesive sheet used t...

Semiconductor device manufacturing method

Thermosetting die-bonding film

Dicing/die bonding film

Dicing die-bonding film

Dicing die-bonding film, method of fixing chipped work and semicond...

Manufacturing method of semiconductor device, adhesive sheet used t...

Thermosetting die bonding film

Adhesive film material for use in manufacturing semiconductors

Dicing die-bonding film

Dicing die-bonding film, method of fixing chipped work and semicond...

Dicing die-bonding film

Process for producing a semiconductor device

Battery separator containing carbodiimide polymer

Battery containing a polycarbodiimide polymer

Anisotropic conductive film

Process for producing semiconductor wafer with adhesive film

Polycarbodiimide

Aromatic polycarbodiimide and sheet thereof

Semiconductor sealing epoxy resin composition and semiconductor dev...

Aromatic polycarbodiimide and polycarbodiimide sheet

Patents Applicationslast 30 patents

ADHESIVE FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SE...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...

LIGHT-EMITTING DIODE ELEMENT AND LIGHT-EMITTING DIODE DEVICE

METHOD FOR PRODUCING LIGHT-EMITTING DIODE DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

THERMOSETTING DIE-BONDING FILM

DICING DIE-BONDING FILM

PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICOND...

PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...

DICING/DIE BONDING FILM

DICING/DIE BONDING FILM

DICING DIE-BONDING FILM

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...

THERMOSETTING DIE BONDING FILM

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...

DICING DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICOND...

Dicing die-bonding film

Process for producing a semiconductor device

Dicing die-bonding film, method of fixing chipped work and semicond...

Adhesives composition, adhesive film, and semiconductor apparatus u...

Process of producing semiconductor device and resin composition she...

Process for producing semiconductor wafer with adhesive film

Separator for battery

Anisotropic conductive film

Polycarbodiimide