Sadanand R. Patil

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for manufacturing a radio frequency identification tag with...
- Patent number 8,635,762
- Issue date Jan 28, 2014
- National Semiconductor Corporation
- Nikhil V. Kelkar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Universal lead frame for micro-array packages
- Patent number 7,846,775
- Issue date Dec 7, 2010
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical die contact structure and fabrication method
- Patent number 7,795,126
- Issue date Sep 14, 2010
- National Semiconductor Corporation
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical die contact structure and fabrication method
- Patent number 7,340,181
- Issue date Mar 4, 2008
- National Semiconductor Corporation
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design of a two interconnect IC chip for a radio frequency identifi...
- Patent number 7,230,580
- Issue date Jun 12, 2007
- National Semiconductor Corporation
- Nikhil V. Kelkar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and method for dicing semiconductor wafers
- Patent number 6,933,212
- Issue date Aug 23, 2005
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless package
- Patent number 6,723,585
- Issue date Apr 20, 2004
- National Semiconductor Corporation
- Nghia Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to decouple core circuits power supply from input-output...
- Patent number 5,672,911
- Issue date Sep 30, 1997
- LSI Logic Corporation
- Sadanand R. Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral dam and heat sink for semiconductor device assembly
- Patent number 5,227,663
- Issue date Jul 13, 1993
- LSI Logic Corporation
- Sadanand Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for semiconductor device assembly
- Patent number 5,175,612
- Issue date Dec 29, 1992
- LSI Logic Corporation
- Jon Long
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR MANUFACTURING A RADIO FREQUENCY IDENTIFICATION TAG WITH...
- Publication number 20140103120
- Publication date Apr 17, 2014
- Nikhil V. Kelkar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL DIE CONTACT STRUCTURE AND FABRICATION METHOD
- Publication number 20080102604
- Publication date May 1, 2008
- National Semiconductor Corporation
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS

Sadanand R. Patil

Person

Patents Grantslast 30 patents

Methods for manufacturing a radio frequency identification tag with...

Universal lead frame for micro-array packages

Electrical die contact structure and fabrication method

Electrical die contact structure and fabrication method

Design of a two interconnect IC chip for a radio frequency identifi...

Apparatus and method for dicing semiconductor wafers

Leadless package

Apparatus to decouple core circuits power supply from input-output...

Integral dam and heat sink for semiconductor device assembly

Heat sink for semiconductor device assembly

Patents Applicationslast 30 patents

METHODS FOR MANUFACTURING A RADIO FREQUENCY IDENTIFICATION TAG WITH...

ELECTRICAL DIE CONTACT STRUCTURE AND FABRICATION METHOD