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Sadao Matsumoto
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Tochigi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Surface treated electrodeposited copper foil and circuit board
Patent number
8,153,273
Issue date
Apr 10, 2012
The Furukawa Electric Co., Ltd.
Takahiro Saito
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for preparing a circuit board material having a conductive b...
Patent number
7,794,578
Issue date
Sep 14, 2010
The Furukawa Electric Co., Ltd.
Akira Matsuda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conductive substrate with resistance layer, resistance board, and r...
Patent number
7,215,235
Issue date
May 8, 2007
Furukawa Circuit Foil Co., LTD
Akira Matsuda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Surface treated electrodeposited copper foil, the production method...
Publication number
20070287020
Publication date
Dec 13, 2007
FURUKAWA CIRCUIT FOIL CO., LTD.
Takahiro Saito
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, METHOD OF...
Publication number
20070228443
Publication date
Oct 4, 2007
Furukawa Circuit Foil Co., Ltd.
Yuuki KIKUCHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Conductive base material with resistance layer and circuit board ma...
Publication number
20050280498
Publication date
Dec 22, 2005
Yuuki Kikuchi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Conductive substrate with resistance layer, resistance board, and r...
Publication number
20040201446
Publication date
Oct 14, 2004
Akira Matsuda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Plating bath for forming thin resistance layer, method of formation...
Publication number
20040144656
Publication date
Jul 29, 2004
Akira Matsuda
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR