Sae-il Son

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Gyeonggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 12,100,596
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Hyunki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 10,872,808
- Issue date Dec 22, 2020
- Samsung Electronics., Ltd.
- Jin Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device that includes forming p...
- Patent number 8,993,436
- Issue date Mar 31, 2015
- Samsung Electronics Co., Ltd.
- Dong-Whan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 7,972,958
- Issue date Jul 5, 2011
- Samsung Electronics Co., Ltd.
- Jung-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal interconnection layer of semiconductor device
- Patent number 7,157,366
- Issue date Jan 2, 2007
- Samsung Electronics Co., Ltd.
- Il-Goo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20220293426
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- Hyunki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20190311944
- Publication date Oct 10, 2019
- Samsung Electronics Co., Ltd.
- JIN HO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20140308810
- Publication date Oct 16, 2014
- Samsung Electronics Co., Ltd.
- Dong-Whan KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor device
- Publication number 20090280645
- Publication date Nov 12, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Jung-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming metal interconnection layer of semiconductor device
- Publication number 20050037605
- Publication date Feb 17, 2005
- Il-Goo Kim
- H01 - BASIC ELECTRIC ELEMENTS