Saeed Shojaie

Person

Folsom, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Buried electrical debug access port
- Patent number 11,700,696
- Issue date Jul 11, 2023
- Intel Corporation
- Florence R. Neumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried electrical debug access port
- Patent number 11,064,612
- Issue date Jul 13, 2021
- Intel Corporation
- Florence R. Pon
- G01 - MEASURING TESTING
Information Patent Grant
Compact wirebonding in stacked-chip system in package, and methods...
- Patent number 10,847,450
- Issue date Nov 24, 2020
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip packaging for dice of different sizes
- Patent number 10,204,884
- Issue date Feb 12, 2019
- Intel Corporation
- Saeed S. Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package debug access ports and methods of fabricati...
- Patent number 10,090,261
- Issue date Oct 2, 2018
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with molding compound
- Patent number 9,936,582
- Issue date Apr 3, 2018
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state device miniaturization
- Patent number 9,773,764
- Issue date Sep 26, 2017
- Intel Corporation
- Mark Melone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package debug access ports
- Patent number 9,646,952
- Issue date May 9, 2017
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having a stiffening element and method of m...
- Patent number 7,372,133
- Issue date May 13, 2008
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of reducing bleed-out of underfill and adhesive materials
- Patent number 7,141,452
- Issue date Nov 28, 2006
- Intel Corporation
- Mahesh Sambasivam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BURIED ELECTRICAL DEBUG ACCESS PORT
- Publication number 20210298183
- Publication date Sep 23, 2021
- Intel Corporation
- Florence R. PON
- G01 - MEASURING TESTING
Information Patent Application
COMPACT WIREBONDING IN STACKED-CHIP SYSTEM IN PACKAGE, AND METHODS...
- Publication number 20190181072
- Publication date Jun 13, 2019
- Saeed SHOJAIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGING FOR DICE OF DIFFERENT SIZES
- Publication number 20190131278
- Publication date May 2, 2019
- Intel Corporation
- Saeed S. Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE DEVICE MINIATURIZATION
- Publication number 20180138159
- Publication date May 17, 2018
- Intel Corporation
- Mark Melone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH THERMAL COUPLING
- Publication number 20180090467
- Publication date Mar 29, 2018
- Intel Corporation
- Hyoung II Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGING FOR DICE OF DIFFERENT SIZES
- Publication number 20180005990
- Publication date Jan 4, 2018
- Intel Corporation
- Saeed S. Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED ELECTRICAL DEBUG ACCESS PORT
- Publication number 20170285097
- Publication date Oct 5, 2017
- Intel Corporation
- Florence R. PON
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC PACKAGE DEBUG ACCESS PORTS AND METHODS OF FABRICATI...
- Publication number 20170200685
- Publication date Jul 13, 2017
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE DEVICE MINIATURIZATION
- Publication number 20170179090
- Publication date Jun 22, 2017
- Intel Corporation
- Mark Melone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE DEBUG ACCESS PORTS
- Publication number 20170084573
- Publication date Mar 23, 2017
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH MOLDING COMPOUND
- Publication number 20150359100
- Publication date Dec 10, 2015
- Intel Corporation
- Junfeng Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic package having a stiffening element and method of m...
- Publication number 20070126094
- Publication date Jun 7, 2007
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of reducing bleed-out of underfill and adhesive materials
- Publication number 20050118748
- Publication date Jun 2, 2005
- Mahesh Sambasivam
- H01 - BASIC ELECTRIC ELEMENTS

Saeed Shojaie

Person

Patents Grantslast 30 patents

Buried electrical debug access port

Buried electrical debug access port

Compact wirebonding in stacked-chip system in package, and methods...

Multichip packaging for dice of different sizes

Microelectronic package debug access ports and methods of fabricati...

Integrated circuit assemblies with molding compound

Solid state device miniaturization

Microelectronic package debug access ports

Microelectronic package having a stiffening element and method of m...

Methods of reducing bleed-out of underfill and adhesive materials

Patents Applicationslast 30 patents

BURIED ELECTRICAL DEBUG ACCESS PORT

COMPACT WIREBONDING IN STACKED-CHIP SYSTEM IN PACKAGE, AND METHODS...

MULTICHIP PACKAGING FOR DICE OF DIFFERENT SIZES

SOLID STATE DEVICE MINIATURIZATION

PACKAGE WITH THERMAL COUPLING

MULTICHIP PACKAGING FOR DICE OF DIFFERENT SIZES

BURIED ELECTRICAL DEBUG ACCESS PORT

MICROELECTRONIC PACKAGE DEBUG ACCESS PORTS AND METHODS OF FABRICATI...

SOLID STATE DEVICE MINIATURIZATION

MICROELECTRONIC PACKAGE DEBUG ACCESS PORTS

INTEGRATED CIRCUIT ASSEMBLIES WITH MOLDING COMPOUND

Microelectronic package having a stiffening element and method of m...

Methods of reducing bleed-out of underfill and adhesive materials