Sagar Pushpala

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Bond pad configurations for semiconductor dies
- Patent number 8,558,396
- Issue date Oct 15, 2013
- Intersil Americas Inc.
- Nikhil Vishwanath Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side fabricated semiconductor wafer
- Patent number 6,010,951
- Issue date Jan 4, 2000
- National Semiconductor Corporation
- Sagar Pushpala
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD CONFIGURATIONS FOR SEMICONDUCTOR DIES
- Publication number 20130015592
- Publication date Jan 17, 2013
- Intersil Americas Inc.
- Nikhil Vishwanath Kelkar
- H01 - BASIC ELECTRIC ELEMENTS