Saikumar Jayaraman

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for device authentication in supply chain
- Patent number 12,088,695
- Issue date Sep 10, 2024
- Intel Corporation
- David Kehlet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermally-optimized tunable stack in cavity package-on-package
- Patent number 11,769,753
- Issue date Sep 26, 2023
- Intel Corporation
- George Vakanas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture and processes to enable high capacity memory packages...
- Patent number 11,456,281
- Issue date Sep 27, 2022
- Intel Corporation
- Yí Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar based socket
- Patent number 10,522,450
- Issue date Dec 31, 2019
- Intel Corporation
- Gregorio Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 10,115,606
- Issue date Oct 30, 2018
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a stress compensation layer and structures formed thereby
- Patent number 9,929,080
- Issue date Mar 27, 2018
- Intel Corporation
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package stack
- Patent number 9,859,253
- Issue date Jan 2, 2018
- Intel Corporation
- Saikumar Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated WLUF and SOD process
- Patent number 9,728,515
- Issue date Aug 8, 2017
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-on-die using water-soluble resist system and method
- Patent number 9,659,889
- Issue date May 23, 2017
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoset polymides for microelectronic applications
- Patent number 9,646,903
- Issue date May 9, 2017
- Intel Corporation
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry-removable protective coatings
- Patent number 9,472,517
- Issue date Oct 18, 2016
- Intel Corporation
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Integrated WLUF and SOD process
- Patent number 9,349,698
- Issue date May 24, 2016
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 9,330,993
- Issue date May 3, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 9,247,686
- Issue date Jan 26, 2016
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 8,703,286
- Issue date Apr 22, 2014
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoset polyimides for microelectronic applications
- Patent number 8,643,199
- Issue date Feb 4, 2014
- Intel Corporation
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive compositions based on polycyclic polymers
- Patent number 8,114,948
- Issue date Feb 14, 2012
- Sumitomo Bakelite Company, Ltd.
- Edmund Elce
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of fabricating a capillary-flow underfill compositions
- Patent number 8,093,105
- Issue date Jan 10, 2012
- Intel Corporation
- Rahul N. Manepalli
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Directly photodefinable polymer compositions and methods thereof
- Patent number 8,053,515
- Issue date Nov 8, 2011
- Promerus LLC
- Edmund Elce
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 7,967,942
- Issue date Jun 28, 2011
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary-flow underfill compositions, packages containing same, an...
- Patent number 7,948,090
- Issue date May 24, 2011
- Intel Corporation
- Rahul N. Manepalli
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymerized cycloolefins using transition metal catalyst and end pr...
- Patent number 7,910,674
- Issue date Mar 22, 2011
- Promerus, LLC
- Larry Funderburk Rhodes
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polycyclic polymers containing pendant ion conducting moieties
- Patent number 7,851,575
- Issue date Dec 14, 2010
- Promerus LLC
- Ramakrishna Ravikiran
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated heat spreader, heat sink or heat pipe with pre-attached...
- Patent number 7,846,778
- Issue date Dec 7, 2010
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package thermal interface materials with dielectric obstructio...
- Patent number 7,776,657
- Issue date Aug 17, 2010
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bumping process
- Patent number 7,718,216
- Issue date May 18, 2010
- Intel Corporation
- Terry Lee Sterrett
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermoset polyimides for microelectronic applications
- Patent number 7,534,649
- Issue date May 19, 2009
- Intel Corporation
- Stephen E. Lehman, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bumping process
- Patent number 7,521,115
- Issue date Apr 21, 2009
- Intel Corporation
- Terry Lee Sterrett
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfill and mold compounds including siloxane-based aromatic diam...
- Patent number 7,479,449
- Issue date Jan 20, 2009
- Intel Corporation
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated heat spreader, heat sink or heat pipe with pre-attached...
- Patent number 7,473,995
- Issue date Jan 6, 2009
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE
- Publication number 20250110295
- Publication date Apr 3, 2025
- Intel Corporation
- Ziyin Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS
- Publication number 20250102744
- Publication date Mar 27, 2025
- Intel Corporation
- Feifei Cheng
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT WITHIN A CAVITY OF INTERPOSER
- Publication number 20250004223
- Publication date Jan 2, 2025
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
METHODS AND TOOLS FOR PREVENTING THE COUNTERFEITING AND TAMPERING O...
- Publication number 20240054502
- Publication date Feb 15, 2024
- Intel Corporation
- Michael A. SCHROEDER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICRO SOCKET ELECTRICAL COUPLINGS FOR DIES
- Publication number 20220200183
- Publication date Jun 23, 2022
- Intel Corporation
- Srikant NEKKANTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DEVICE AUTHENTICATION IN SUPPLY CHAIN
- Publication number 20220116206
- Publication date Apr 14, 2022
- Intel Corporation
- David KEHLET
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARCHITECTURE AND PROCESSES TO ENABLE HIGH CAPACITY MEMORY PACKAGES...
- Publication number 20200105719
- Publication date Apr 2, 2020
- Intel Corporation
- Yi LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE
- Publication number 20200043894
- Publication date Feb 6, 2020
- Intel Corporation
- George VAKANAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY
- Publication number 20180182697
- Publication date Jun 28, 2018
- Intel Corporation
- Daewoong SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACK
- Publication number 20180005989
- Publication date Jan 4, 2018
- Intel Corporation
- Saikumar Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
- Publication number 20170033069
- Publication date Feb 2, 2017
- Intel Corporation
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATED WLUF AND SOD PROCESS
- Publication number 20160247774
- Publication date Aug 25, 2016
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20160240395
- Publication date Aug 18, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
- Publication number 20150270235
- Publication date Sep 24, 2015
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD
- Publication number 20150179595
- Publication date Jun 25, 2015
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS
- Publication number 20140182763
- Publication date Jul 3, 2014
- Saikumar Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20140175634
- Publication date Jun 26, 2014
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSET POLYMIDES FOR MICROELECTRONIC APPLICATIONS
- Publication number 20140148557
- Publication date May 29, 2014
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED WLUF AND SOD PROCESS
- Publication number 20140001631
- Publication date Jan 2, 2014
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY-FLOW UNDERFILL COMPOSITIONS, PACKAGES CONTAINING SAME, AN...
- Publication number 20110223722
- Publication date Sep 15, 2011
- Rahul N. Manepalli
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS
- Publication number 20110194254
- Publication date Aug 11, 2011
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSET POLYIMIDES FOR MICROELECTRONIC APPLICATIONS
- Publication number 20090146289
- Publication date Jun 11, 2009
- Stephen E. Lehman, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polycyclic polymers containing pendant ion conducting moieties
- Publication number 20080242750
- Publication date Oct 2, 2008
- Promerus LLC
- R. Ravikiran
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIRECTLY PHOTODEFINABLE POLYMER COMPOSITIONS AND METHODS THEREOF
- Publication number 20080194740
- Publication date Aug 14, 2008
- Edmund Elce
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CAPILLARY-FLOW UNDERFILL COMPOSITIONS, PACKAGES CONTAINING SAME, AN...
- Publication number 20080150170
- Publication date Jun 26, 2008
- Rahul N. Manepalli
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIO...
- Publication number 20080064144
- Publication date Mar 13, 2008
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL AND MOLD COMPOUNDS INCLUDING SILOXANE-BASED AROMATIC DIAM...
- Publication number 20080009130
- Publication date Jan 10, 2008
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Phase change material containing fusible particles as thermally con...
- Publication number 20070287005
- Publication date Dec 13, 2007
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermoset polyimides for microelectronic applications
- Publication number 20070262421
- Publication date Nov 15, 2007
- Stephen E. Lehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer matrices for polymer solder hybrid materials
- Publication number 20070251639
- Publication date Nov 1, 2007
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Saikumar Jayaraman

Person

Patents Grantslast 30 patents

Systems and methods for device authentication in supply chain

Thermally-optimized tunable stack in cavity package-on-package

Architecture and processes to enable high capacity memory packages...

Pillar based socket

Methods of promoting adhesion between underfill and conductive bump...

Forming a stress compensation layer and structures formed thereby

Integrated circuit package stack

Integrated WLUF and SOD process

Solder-on-die using water-soluble resist system and method

Thermoset polymides for microelectronic applications

Dry-removable protective coatings

Integrated WLUF and SOD process

Methods of promoting adhesion between underfill and conductive bump...

Polymer matrices for polymer solder hybrid materials

Polymer matrices for polymer solder hybrid materials

Thermoset polyimides for microelectronic applications

Photosensitive compositions based on polycyclic polymers

Method of fabricating a capillary-flow underfill compositions

Directly photodefinable polymer compositions and methods thereof

Polymer matrices for polymer solder hybrid materials

Capillary-flow underfill compositions, packages containing same, an...

Polymerized cycloolefins using transition metal catalyst and end pr...

Polycyclic polymers containing pendant ion conducting moieties

Integrated heat spreader, heat sink or heat pipe with pre-attached...

Chip package thermal interface materials with dielectric obstructio...

Low temperature bumping process

Thermoset polyimides for microelectronic applications

Low temperature bumping process

Underfill and mold compounds including siloxane-based aromatic diam...

Integrated heat spreader, heat sink or heat pipe with pre-attached...

Patents Applicationslast 30 patents

POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE

TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS

PHOTONIC INTEGRATED CIRCUIT WITHIN A CAVITY OF INTERPOSER

METHODS AND TOOLS FOR PREVENTING THE COUNTERFEITING AND TAMPERING O...

MICRO SOCKET ELECTRICAL COUPLINGS FOR DIES

SYSTEMS AND METHODS FOR DEVICE AUTHENTICATION IN SUPPLY CHAIN

ARCHITECTURE AND PROCESSES TO ENABLE HIGH CAPACITY MEMORY PACKAGES...

THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE

FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY

INTEGRATED CIRCUIT PACKAGE STACK

DRY-REMOVABLE PROTECTIVE COATINGS

INTEGRATED WLUF AND SOD PROCESS

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...

DRY-REMOVABLE PROTECTIVE COATINGS

SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD

POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...

THERMOSET POLYMIDES FOR MICROELECTRONIC APPLICATIONS

INTEGRATED WLUF AND SOD PROCESS

CAPILLARY-FLOW UNDERFILL COMPOSITIONS, PACKAGES CONTAINING SAME, AN...

POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS

THERMOSET POLYIMIDES FOR MICROELECTRONIC APPLICATIONS

Polycyclic polymers containing pendant ion conducting moieties

DIRECTLY PHOTODEFINABLE POLYMER COMPOSITIONS AND METHODS THEREOF

CAPILLARY-FLOW UNDERFILL COMPOSITIONS, PACKAGES CONTAINING SAME, AN...

CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIO...

UNDERFILL AND MOLD COMPOUNDS INCLUDING SILOXANE-BASED AROMATIC DIAM...

Phase change material containing fusible particles as thermally con...

Thermoset polyimides for microelectronic applications

Polymer matrices for polymer solder hybrid materials