Sairam Agraharam

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge co-planar placement architectures and processes
- Patent number 12,176,268
- Issue date Dec 24, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation of microelectronic components with direct bonding inter...
- Patent number 12,119,317
- Issue date Oct 15, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,887,962
- Issue date Jan 30, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 11,817,444
- Issue date Nov 14, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level passive heat spreader interposer to enable improved the...
- Patent number 11,804,470
- Issue date Oct 31, 2023
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor package including a bridge die disposed in...
- Patent number 11,791,274
- Issue date Oct 17, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 11,348,911
- Issue date May 31, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for microelectronics packages
- Patent number 11,114,388
- Issue date Sep 7, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 10,916,514
- Issue date Feb 9, 2021
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 10,700,051
- Issue date Jun 30, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing a thermal soluti...
- Patent number 10,607,909
- Issue date Mar 31, 2020
- Intel Corporation
- Purushotham Kaushik Muthur Srinath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 10,461,047
- Issue date Oct 29, 2019
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for microelectronics packages
- Patent number 10,256,198
- Issue date Apr 9, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 10,128,225
- Issue date Nov 13, 2018
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-rectangular electronic device components
- Patent number 10,090,259
- Issue date Oct 2, 2018
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 9,613,934
- Issue date Apr 4, 2017
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with narrow-factor via including finish layer
- Patent number 9,603,247
- Issue date Mar 21, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible computing fabric
- Patent number 9,526,285
- Issue date Dec 27, 2016
- Intel Corporation
- Aleksandar Aleksov
- A41 - WEARING APPAREL
Information Patent Grant
3D integrated circuit package with window interposer
- Patent number 9,391,013
- Issue date Jul 12, 2016
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable imaging sensor for communications
- Patent number 9,374,509
- Issue date Jun 21, 2016
- Intel Corporation
- Ravi Pillarisetty
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package with spatially varied solder resist open...
- Patent number 9,312,237
- Issue date Apr 12, 2016
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit package with window interposer
- Patent number 9,129,958
- Issue date Sep 8, 2015
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to increase I/O density and reduce layer counts in BBUL pack...
- Patent number 9,041,207
- Issue date May 26, 2015
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 8,987,918
- Issue date Mar 24, 2015
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution to deal with die warpage during 3D die-to-die stacking
- Patent number 8,970,051
- Issue date Mar 3, 2015
- Intel Corporation
- Hualiang Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...
- Publication number 20250015028
- Publication date Jan 9, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
- Publication number 20240222301
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES
- Publication number 20240222283
- Publication date Jul 4, 2024
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20240128256
- Publication date Apr 18, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...
- Publication number 20230317653
- Publication date Oct 5, 2023
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230238339
- Publication date Jul 27, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-ALIGNED TEMPLATE STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20230197546
- Publication date Jun 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY
- Publication number 20230197637
- Publication date Jun 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE WAFER STACK ARCHITECTURE TO ENABLE SINGULATION
- Publication number 20230197685
- Publication date Jun 22, 2023
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
- Publication number 20230087367
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoxuan Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SOLDER-FREE DIE CONNECTION TO REDISTRIB...
- Publication number 20230093186
- Publication date Mar 23, 2023
- Intel Corporation
- Tarek A. Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES
- Publication number 20220270976
- Publication date Aug 25, 2022
- Xiaoxuan Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20220231007
- Publication date Jul 21, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20220199480
- Publication date Jun 23, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF MET...
- Publication number 20220199503
- Publication date Jun 23, 2022
- Intel Corporation
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20220157803
- Publication date May 19, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...
- Publication number 20220102305
- Publication date Mar 31, 2022
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391273
- Publication date Dec 16, 2021
- Interl Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
- Publication number 20210391281
- Publication date Dec 16, 2021
- Intel Corporation
- ERIC J. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391295
- Publication date Dec 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE POWER DELIVERY ARCHITECTURES AND PROCESSES
- Publication number 20210305133
- Publication date Sep 30, 2021
- Intel Coporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES
- Publication number 20210305132
- Publication date Sep 30, 2021
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20210125942
- Publication date Apr 29, 2021
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PASSIVE HEAT SPREADER INTERPOSER TO ENABLE IMPROVED THE...
- Publication number 20210057381
- Publication date Feb 25, 2021
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20200395352
- Publication date Dec 17, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20200013734
- Publication date Jan 9, 2020
- Intel Corporation
- Dae-Woo KIM
- G01 - MEASURING TESTING
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20190371778
- Publication date Dec 5, 2019
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS
- Publication number 20190304931
- Publication date Oct 3, 2019
- Intel Corporation
- Pramod Malatkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
- Publication number 20190259713
- Publication date Aug 22, 2019
- Intel Corporation
- ERIC J. LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sairam Agraharam

Person

Patents Grantslast 30 patents

Multi-chip packaging

Open cavity bridge co-planar placement architectures and processes

Metal-free frame design for silicon bridges for semiconductor packages

Singulation of microelectronic components with direct bonding inter...

Metal-free frame design for silicon bridges for semiconductor packages

Open cavity bridge power delivery architectures and processes

Microelectronic structures including bridges

Multi-chip packaging

Wafer level passive heat spreader interposer to enable improved the...

Multichip semiconductor package including a bridge die disposed in...

Metal-free frame design for silicon bridges for semiconductor packages

Multi-chip packaging

Warpage control for microelectronics packages

Metal-free frame design for silicon bridges for semiconductor packages

Multi-chip packaging

Systems, methods, and apparatuses for implementing a thermal soluti...

Metal-free frame design for silicon bridges for semiconductor packages

Warpage control for microelectronics packages

Interconnect structures with polymer core

Non-rectangular electronic device components

Interconnect structures with polymer core

Electronic package with narrow-factor via including finish layer

Flexible computing fabric

3D integrated circuit package with window interposer

Wearable imaging sensor for communications

Integrated circuit package with spatially varied solder resist open...

3D integrated circuit package with window interposer

Method to increase I/O density and reduce layer counts in BBUL pack...

Interconnect structures with polymer core

Solution to deal with die warpage during 3D die-to-die stacking

Patents Applicationslast 30 patents

SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...

METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES

MULTI-CHIP PACKAGING

HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

EDGE-ALIGNED TEMPLATE STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES

MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY

MULTIPLE WAFER STACK ARCHITECTURE TO ENABLE SINGULATION

MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS

SEMICONDUCTOR DEVICE HAVING SOLDER-FREE DIE CONNECTION TO REDISTRIB...

MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES

MULTI-CHIP PACKAGING

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF MET...

MULTI-CHIP PACKAGING

SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

OPEN CAVITY BRIDGE POWER DELIVERY ARCHITECTURES AND PROCESSES

OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

WAFER LEVEL PASSIVE HEAT SPREADER INTERPOSER TO ENABLE IMPROVED THE...

MULTI-CHIP PACKAGING

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

MULTI-CHIP PACKAGING

NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS

WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES