TREA

Sakae Matsuzaki

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Support base
    • Patent number 11,241,770
    • Issue date Feb 8, 2022
    • Disco Corporation
    • Sakae Matsuzaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing device chips and pick up apparatus
    • Patent number 10,847,403
    • Issue date Nov 24, 2020
    • Disco Corporation
    • Sakae Matsuzaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electrostatic chuck table
    • Patent number 10,490,450
    • Issue date Nov 26, 2019
    • Disco Corporation
    • Sakae Matsuzaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electrostatic chuck table using method
    • Patent number 10,410,901
    • Issue date Sep 10, 2019
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,379,015
    • Issue date Jun 28, 2016
    • Disco Corporation
    • Sakae Matsuzaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,236,264
    • Issue date Jan 12, 2016
    • Disco Corporation
    • Sakae Matsuzaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Dividing method for wafer
    • Patent number 9,159,622
    • Issue date Oct 13, 2015
    • Disco Corporation
    • Sakae Matsuzaki
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SUPPORT BASE
    • Publication number 20190217440
    • Publication date Jul 18, 2019
    • Disco Corporation
    • Sakae MATSUZAKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING DEVICE CHIPS AND PICK UP APPARATUS
    • Publication number 20190181029
    • Publication date Jun 13, 2019
    • Disco Corporation
    • Sakae MATSUZAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SMALL-DIAMETER WAFER
    • Publication number 20190148132
    • Publication date May 16, 2019
    • Disco Corporation
    • Hideji HORITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROSTATIC CHUCK TABLE USING METHOD
    • Publication number 20180247853
    • Publication date Aug 30, 2018
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTROSTATIC CHUCK TABLE
    • Publication number 20180019168
    • Publication date Jan 18, 2018
    • Disco Corporation
    • Sakae Matsuzaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20150132925
    • Publication date May 14, 2015
    • Disco Corporation
    • Sakae Matsuzaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIVIDING METHOD FOR WAFER
    • Publication number 20150044857
    • Publication date Feb 12, 2015
    • Disco Corporation
    • Sakae Matsuzaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VACUUM PROCESSING APPARATUS
    • Publication number 20140209240
    • Publication date Jul 31, 2014
    • Disco Corporation
    • Sakae Matsuzaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20140141596
    • Publication date May 22, 2014
    • Disco Corporation
    • Sakae Matsuzaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR