TREA

Sakie Yamagata

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  • Souka-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Solder paste
    • Patent number 8,388,724
    • Issue date Mar 5, 2013
    • Senju Metal Industry Co., Ltd.
    • Rikiya Kato
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Reflow soldering method
    • Patent number 6,935,553
    • Issue date Aug 30, 2005
    • Senju Metal Industry Co., Ltd.
    • Tadatomo Suga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Residue-free solder paste
    • Patent number 6,887,319
    • Issue date May 3, 2005
    • Senju Metal Industry Co., Ltd.
    • Tadatomo Suga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Solder Paste
    • Publication number 20090220812
    • Publication date Sep 3, 2009
    • Rikiya Kato
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder paste
    • Publication number 20070102481
    • Publication date May 10, 2007
    • Rikiya Kato
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Reflow soldering method
    • Publication number 20040007610
    • Publication date Jan 15, 2004
    • Tadatomo Suga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Residue-free solder paste
    • Publication number 20040000355
    • Publication date Jan 1, 2004
    • Tadatomo Suga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR