Sally Foong

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Tape chip on lead using paste die attach material
- Patent number 9,679,831
- Issue date Jun 13, 2017
- Cypress Semiconductor Corporation
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package assembly with improved bond wire separation
- Patent number 9,431,364
- Issue date Aug 30, 2016
- Cypess Semiconductor Corporation
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip positioning for multi-chip packaging
- Patent number 9,196,608
- Issue date Nov 24, 2015
- Cypress Semiconductor Corporation
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip positioning in multi-chip package
- Patent number 8,901,756
- Issue date Dec 2, 2014
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having multiple wire bonds for a bond area and methods thereof
- Patent number 8,791,007
- Issue date Jul 29, 2014
- Spansion LLC
- Gin Ghee Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thin multi chip stack package with film on wi...
- Patent number 8,680,686
- Issue date Mar 25, 2014
- Spansion LLC
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stitch bump stacking design for overall package size reduction for...
- Patent number 8,357,563
- Issue date Jan 22, 2013
- Spansion LLC
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of package height in a stacked die configuration
- Patent number 7,932,131
- Issue date Apr 26, 2011
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process applying die attach film to singulated die
- Patent number 7,799,612
- Issue date Sep 21, 2010
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die offset die to die bonding
- Patent number 7,750,481
- Issue date Jul 6, 2010
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die offset die to bonding
- Patent number 7,674,653
- Issue date Mar 9, 2010
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die offset die to die bonding
- Patent number 7,554,204
- Issue date Jun 30, 2009
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for handling thin semiconductor wafers
- Patent number 7,157,376
- Issue date Jan 2, 2007
- Advanced Micro Devices, Inc.
- Sally Y. L. Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical clamper for heated substrates at die attach
- Patent number 6,547,121
- Issue date Apr 15, 2003
- Advanced Micro Devices, Inc.
- Sally Y. L. Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using removable spacers to ensure adequate bondline thickness
- Patent number 6,383,843
- Issue date May 7, 2002
- Advanced Micro Devices, Inc.
- Sally Y. L. Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device encapsulation process utilizing pre-cut slots in flexible fi...
- Patent number 6,344,161
- Issue date Feb 5, 2002
- Advanced Micro Devices, Inc.
- L. K. Suresh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of making stacked die assemblies and modules
- Patent number 6,337,225
- Issue date Jan 8, 2002
- Advanced Micro Devices, Inc.
- Sally Yin Lye Foong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TAPE CHIP ON LEAD USING PASTE DIE ATTACH MATERIAL
- Publication number 20170047272
- Publication date Feb 16, 2017
- CYPRESS SEMICONDUCTOR CORPORATION
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP POSITIONING IN MULTI-CHIP PACKAGE
- Publication number 20150056726
- Publication date Feb 26, 2015
- SPANSION LLC
- Sally FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package Assembly with Improved Bond Wire Separation
- Publication number 20140191417
- Publication date Jul 10, 2014
- SPANSION LLC
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Positioning in Multi-Chip Package
- Publication number 20140175613
- Publication date Jun 26, 2014
- SPANSION LLC
- Sally FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR...
- Publication number 20120038059
- Publication date Feb 16, 2012
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THIN MULTI CHIP STACK PACKAGE WITH FILM ON WI...
- Publication number 20110316158
- Publication date Dec 29, 2011
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduction of package height in a stacked die configuration
- Publication number 20090115033
- Publication date May 7, 2009
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die offset die to die bonding
- Publication number 20090091043
- Publication date Apr 9, 2009
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die offset die to bonding
- Publication number 20090093084
- Publication date Apr 9, 2009
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM
- Publication number 20090001599
- Publication date Jan 1, 2009
- SPANSION LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS APPLYING DIE ATTACH FILM TO SINGULATED DIE
- Publication number 20080318364
- Publication date Dec 25, 2008
- SPANSION LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die offset die to die bonding
- Publication number 20080308947
- Publication date Dec 18, 2008
- Spansion LLC
- Nguk Chin Lai
- H01 - BASIC ELECTRIC ELEMENTS

Sally Foong

Person

Patents Grantslast 30 patents

Tape chip on lead using paste die attach material

Multi-chip package assembly with improved bond wire separation

Method of chip positioning for multi-chip packaging

Chip positioning in multi-chip package

Device having multiple wire bonds for a bond area and methods thereof

Method and system for thin multi chip stack package with film on wi...

Stitch bump stacking design for overall package size reduction for...

Reduction of package height in a stacked die configuration

Process applying die attach film to singulated die

Die offset die to die bonding

Die offset die to bonding

Die offset die to die bonding

Method and apparatus for handling thin semiconductor wafers

Mechanical clamper for heated substrates at die attach

Using removable spacers to ensure adequate bondline thickness

Device encapsulation process utilizing pre-cut slots in flexible fi...

Method of making stacked die assemblies and modules

Patents Applicationslast 30 patents

TAPE CHIP ON LEAD USING PASTE DIE ATTACH MATERIAL

CHIP POSITIONING IN MULTI-CHIP PACKAGE

Multi-Chip Package Assembly with Improved Bond Wire Separation

Chip Positioning in Multi-Chip Package

STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR...

METHOD AND SYSTEM FOR THIN MULTI CHIP STACK PACKAGE WITH FILM ON WI...

Reduction of package height in a stacked die configuration

Die offset die to die bonding

Die offset die to bonding

DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM

PROCESS APPLYING DIE ATTACH FILM TO SINGULATED DIE

Die offset die to die bonding