TREA

Sally J. Yankee

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  • Underhill, VT, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Copper to aluminum interlayer interconnect using stud and via liner
    • Patent number 7,087,997
    • Issue date Aug 8, 2006
    • International Business Machines Corporation
    • Lloyd G. Burrell
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Copper to aluminum interlayer interconnect using stud and via liner
    • Patent number 7,037,824
    • Issue date May 2, 2006
    • International Business Machines Corporation
    • Lloyd G. Burrell
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Heat dissipation from IC interconnects
    • Patent number 6,798,066
    • Issue date Sep 28, 2004
    • International Business Machines Corporation
    • William T. Motsiff
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Recessed bond pad
    • Patent number 6,650,021
    • Issue date Nov 18, 2003
    • International Business Machines Corporation
    • Anthony K. Stamper
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method and structure of column interconnect
    • Patent number 6,495,917
    • Issue date Dec 17, 2002
    • International Business Machines Corporation
    • John J. Ellis-Monaghan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Recessed bond pad
    • Patent number 6,420,254
    • Issue date Jul 16, 2002
    • International Business Machines Corporation
    • Anthony K. Stamper
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Recessed bond pad
    • Patent number 6,362,531
    • Issue date Mar 26, 2002
    • International Business Machines Corporation
    • Anthony K. Stamper
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents