Salvatore Pavone

Person

Murphy, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact with bronze material to mitigate undercut
- Patent number 12,237,219
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members for die attach in flip chip packages
- Patent number 12,100,678
- Issue date Sep 24, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating for thermal management
- Patent number 12,068,221
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride metal layer covers
- Patent number 11,876,056
- Issue date Jan 16, 2024
- Texas Instruments Incorporated
- Jonathan Andrew Montoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,876,065
- Issue date Jan 16, 2024
- Texas Instruments Incorporated
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packages with visible solder fillets
- Patent number 11,855,024
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Qiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,594,504
- Issue date Feb 28, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 11,587,858
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zinc layer for a semiconductor die pillar
- Patent number 11,443,996
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brass-coated metals in flip-chip redistribution layers
- Patent number 11,410,947
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipchip package with an IC having a covered cavity comprising meta...
- Patent number 11,362,020
- Issue date Jun 14, 2022
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure barrier for copper wire bonding
- Patent number 11,127,515
- Issue date Sep 21, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,011,483
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 11,011,488
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact fabrication to mitigate undercut
- Patent number 10,796,956
- Issue date Oct 6, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating for thermal management
- Patent number 10,734,304
- Issue date Aug 4, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayers of nickel alloys as diffusion barrier layers
- Patent number 10,692,830
- Issue date Jun 23, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure barrier for copper wire bonding
- Patent number 10,629,334
- Issue date Apr 21, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 10,566,267
- Issue date Feb 18, 2020
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opening in a multilayer polymeric dielectric layer without delamina...
- Patent number 10,546,821
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Licheng Marshal Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 10,453,817
- Issue date Oct 22, 2019
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alloy diffusion barrier layer
- Patent number 10,424,552
- Issue date Sep 24, 2019
- Texas Instruments Incorporated
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Opening in a multilayer polymeric dielectric layer without delamina...
- Patent number 9,502,365
- Issue date Nov 22, 2016
- Texas Instruments Incorporated
- Licheng Marshal Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PECVD showerhead configuration for CMP uniformity and improved stress
- Patent number 8,470,614
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Jason James New
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
TaN integrated circuit (IC) capacitor
- Patent number 7,573,086
- Issue date Aug 11, 2009
- Texas Instruments Incorporated
- Michael LeRoy Huber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES
- Publication number 20240413114
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20240194574
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE METAL LAYER COVERS
- Publication number 20240153888
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Andrew MONTOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20240153903
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
- Publication number 20240096771
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20230104156
- Publication date Apr 6, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS
- Publication number 20230065075
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zinc Layer For A Semiconductor Die Pillar
- Publication number 20230005807
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DRILLED MOLD CAVITY
- Publication number 20220415762
- Publication date Dec 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20220384375
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20220375836
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE METAL LAYER COVERS
- Publication number 20220352098
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Andrew MONTOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
- Publication number 20220173062
- Publication date Jun 2, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPCHIP PACKAGE WITH AN IC HAVING A COVERED CAVITY COMPRISING META...
- Publication number 20220157698
- Publication date May 19, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS
- Publication number 20210280547
- Publication date Sep 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NIckel Alloy for Semiconductor Packaging
- Publication number 20210242151
- Publication date Aug 5, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20210193600
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES
- Publication number 20210134750
- Publication date May 6, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FABRICATION TO MITIGATE UNDERCUT
- Publication number 20210028060
- Publication date Jan 28, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING FOR THERMAL MANAGEMENT
- Publication number 20200365483
- Publication date Nov 19, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
- Publication number 20200321299
- Publication date Oct 8, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSTRUCTURE BARRIER FOR COPPER WIRE BONDING
- Publication number 20200251257
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20200185309
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING FOR THERMAL MANAGEMENT
- Publication number 20200161210
- Publication date May 21, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS
- Publication number 20200051939
- Publication date Feb 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20200020656
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTACT FABRICATION TO MITIGATE UNDERCUT
- Publication number 20200006134
- Publication date Jan 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nickel Alloy for Semiconductor Packaging
- Publication number 20190259717
- Publication date Aug 22, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zinc Layer For A Semiconductor Die Pillar
- Publication number 20190109062
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS

Salvatore Pavone

Person

Patents Grantslast 30 patents

Contact with bronze material to mitigate undercut

Conductive members for die attach in flip chip packages

Die attach surface copper layer with protective layer for microelec...

Plating for thermal management

Method of forming brass-coated metals in flip-chip redistribution l...

Process for thin film capacitor integration

Silicon nitride metal layer covers

Flip chip package assembly

Wafer chip scale packages with visible solder fillets

Nickel alloy for semiconductor packaging

Zinc-cobalt barrier for interface in solder bond applications

Zinc layer for a semiconductor die pillar

Brass-coated metals in flip-chip redistribution layers

Flipchip package with an IC having a covered cavity comprising meta...

Nanostructure barrier for copper wire bonding

Nickel alloy for semiconductor packaging

Zinc-cobalt barrier for interface in solder bond applications

Contact fabrication to mitigate undercut

Plating for thermal management

Multilayers of nickel alloys as diffusion barrier layers

Nanostructure barrier for copper wire bonding

Die attach surface copper layer with protective layer for microelec...

Opening in a multilayer polymeric dielectric layer without delamina...

Zinc-cobalt barrier for interface in solder bond applications

Alloy diffusion barrier layer

Opening in a multilayer polymeric dielectric layer without delamina...

PECVD showerhead configuration for CMP uniformity and improved stress

TaN integrated circuit (IC) capacitor

Patents Applicationslast 30 patents

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

SILICON NITRIDE METAL LAYER COVERS

FLIP CHIP PACKAGE ASSEMBLY

WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE

FLIP CHIP PACKAGE ASSEMBLY

WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS

Zinc Layer For A Semiconductor Die Pillar

SEMICONDUCTOR PACKAGE WITH DRILLED MOLD CAVITY

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

SILICON NITRIDE METAL LAYER COVERS

MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS

FLIPCHIP PACKAGE WITH AN IC HAVING A COVERED CAVITY COMPRISING META...

ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS

NIckel Alloy for Semiconductor Packaging

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES

CONTACT FABRICATION TO MITIGATE UNDERCUT

PLATING FOR THERMAL MANAGEMENT

MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS

NANOSTRUCTURE BARRIER FOR COPPER WIRE BONDING

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

PLATING FOR THERMAL MANAGEMENT

ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS

ALLOY DIFFUSION BARRIER LAYER

CONTACT FABRICATION TO MITIGATE UNDERCUT

Nickel Alloy for Semiconductor Packaging

Zinc Layer For A Semiconductor Die Pillar