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Sam K. Lee
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Kalispell, MT, US
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Patents Grants
last 30 patents
Information
Patent Grant
Plating and deplating currents for material co-planarity in semicon...
Patent number
12,146,235
Issue date
Nov 19, 2024
Applied Materials, Inc.
Paul R. McHugh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Substrate cleaning components and methods in a plating system
Patent number
11,814,744
Issue date
Nov 14, 2023
Applied Materials, Inc.
Nolan Zimmerman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Fluid recovery in semiconductor processing
Patent number
11,788,200
Issue date
Oct 17, 2023
Applied Materials, Inc.
Sam Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Fluid recovery in semiconductor processing
Patent number
11,352,711
Issue date
Jun 7, 2022
Applied Materials, Inc.
Sam Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Methods of enhancing polymer adhesion to copper
Patent number
9,922,874
Issue date
Mar 20, 2018
Applied Materials, Inc.
Prayudi Lianto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroplating methods for semiconductor substrates
Patent number
9,758,893
Issue date
Sep 12, 2017
Applied Materials, Inc.
Sam K. Lee
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
MODEL-BASED PARAMETER ADJUSTMENTS FOR DEPOSITION PROCESSES
Publication number
20230411222
Publication date
Dec 21, 2023
Applied Materials, Inc.
Sam K. Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...
Publication number
20230279576
Publication date
Sep 7, 2023
Applied Materials, Inc.
Paul R. McHugh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FLUID RECOVERY IN SEMICONDUCTOR PROCESSING
Publication number
20220259756
Publication date
Aug 18, 2022
Applied Materials, Inc.
Sam Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
FLUID RECOVERY IN SEMICONDUCTOR PROCESSING
Publication number
20210017665
Publication date
Jan 21, 2021
Applied Materials, Inc.
Sam Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR REMOVING CONTAMINANTS IN ELECTROPLATING SYS...
Publication number
20190345624
Publication date
Nov 14, 2019
Applied Materials, Inc.
Kwan Wook Roh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SUBSTRATE CLEANING COMPONENTS AND METHODS IN A PLATING SYSTEM
Publication number
20190301049
Publication date
Oct 3, 2019
Applied Materials, Inc.
Nolan Zimmerman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHODS OF ENHANCING POLYMER ADHESION TO COPPER
Publication number
20180005881
Publication date
Jan 4, 2018
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR INCREASING THE RATE OF ELECTROCHEMICAL DEPOSITION
Publication number
20160333492
Publication date
Nov 17, 2016
Applied Materials, Inc.
Eric J. Bergman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROPLATING METHODS FOR SEMICONDUCTOR SUBSTRATES
Publication number
20150225866
Publication date
Aug 13, 2015
Applied Materials, Inc.
Sam K. Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROPLATING PROCESSOR WITH WAFER HEATING OR COOLING
Publication number
20140262804
Publication date
Sep 18, 2014
Applied Materials, Inc.
Sam K. Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR