Sam Ziqun Zhao

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cantilevered power planes to provide a return current path for high...
- Patent number 12,191,243
- Issue date Jan 7, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integration in semiconductor packages
- Patent number 11,906,802
- Issue date Feb 20, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 11,049,829
- Issue date Jun 29, 2021
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin recon interposer package without TSV for fine input/output pit...
- Patent number 10,615,110
- Issue date Apr 7, 2020
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 10,504,862
- Issue date Dec 10, 2019
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density redistribution layer (RDL) interconnect bridge using a...
- Patent number 10,276,403
- Issue date Apr 30, 2019
- Avago Technologies International Sales Pe. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader having thermal interface material retainment
- Patent number 10,079,191
- Issue date Sep 18, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locating wireless-enabled components and applications thereof
- Patent number 10,013,285
- Issue date Jul 3, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Arya Reza Behzad
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thin recon interposer package without TSV for fine input/output pit...
- Patent number 10,008,439
- Issue date Jun 26, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless bus for intra-chip and inter-chip communication, including...
- Patent number 9,891,951
- Issue date Feb 13, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level system in package (SiP) using a reconstituted wafer and...
- Patent number 9,842,827
- Issue date Dec 12, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out 3D IC integration structure without substrate and method of...
- Patent number 9,837,378
- Issue date Dec 5, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless bus for intra-chip and inter-chip communication, including...
- Patent number 9,772,880
- Issue date Sep 26, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vehicle decklid
- Patent number D797631
- Issue date Sep 19, 2017
- GM Global Technology Operations LLC
- Michael J. Pevovar
- D12 - Transportation
Information Patent Grant
Vehicle grille
- Patent number D796390
- Issue date Sep 5, 2017
- GM Global Technology Operations LLC
- Michael J. Pevovar
- D12 - Transportation
Information Patent Grant
Vehicle grille
- Patent number D795757
- Issue date Aug 29, 2017
- GM Global Technology Operations LLC
- Michael J. Pevovar
- D12 - Transportation
Information Patent Grant
Magnetic-core three-dimensional (3D) inductors and packaging integr...
- Patent number 9,693,461
- Issue date Jun 27, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a variable-width vertical channel formed...
- Patent number 9,680,002
- Issue date Jun 13, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle front bumper
- Patent number D786149
- Issue date May 9, 2017
- GM Global Technology Operations LLC
- Michael J. Pevovar
- D12 - Transportation
Information Patent Grant
Apparatus and method to monitor thermal runaway in a semiconductor...
- Patent number 9,618,560
- Issue date Apr 11, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- G01 - MEASURING TESTING
Information Patent Grant
Wireless bus for intra-chip and inter-chip communication, including...
- Patent number 9,612,871
- Issue date Apr 4, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wireless communicating among vertically arranged integrated circuit...
- Patent number 9,570,420
- Issue date Feb 14, 2017
- Broadcom Corporation
- Jesus Alfonso Castaneda
- G02 - OPTICS
Information Patent Grant
Vehicle hood
- Patent number D777620
- Issue date Jan 31, 2017
- GM Global Technology Operations LLC
- Michael J. Pevovar
- D12 - Transportation
Information Patent Grant
Semiconductor interposer having a cavity for intra-interposer die
- Patent number 9,548,251
- Issue date Jan 17, 2017
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle rear fascia
- Patent number D776581
- Issue date Jan 17, 2017
- GM Global Technology Operations LLC
- Michael J. Pevovar
- D12 - Transportation
Information Patent Grant
Hybrid thermal interface material for IC packages with integrated h...
- Patent number 9,472,485
- Issue date Oct 18, 2016
- Broadcom Corporation
- Mehdi Saeidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating a system on the fly and applications thereof
- Patent number 9,459,921
- Issue date Oct 4, 2016
- Broadcom Corporation
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vehicle body exterior
- Patent number D767449
- Issue date Sep 27, 2016
- GM Global Technology Operations LLC
- Michael J. Pevovar
- D12 - Transportation
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,431,371
- Issue date Aug 30, 2016
- Broadcom Corporation
- Sampath K. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant dielectric layer for semiconductor device
- Patent number 9,431,370
- Issue date Aug 30, 2016
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE BACKSIDE POWER DISTRIBUTION NETWORK STRUCTURE...
- Publication number 20250140693
- Publication date May 1, 2025
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...
- Publication number 20250096108
- Publication date Mar 20, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20240339429
- Publication date Oct 10, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20240151921
- Publication date May 9, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Substrate with Differing Dielectric Constants
- Publication number 20240145392
- Publication date May 2, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Seal for Bonded Stacks of Different Size Semiconductor Devices
- Publication number 20240038613
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elastomer Interconnection Substrate Layer
- Publication number 20240038641
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Interconnection Structure
- Publication number 20240038645
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS AND WARPAGE IMPROVEMENTS FOR STIFFENER RING PACKAGE WITH EXP...
- Publication number 20240038615
- Publication date Feb 1, 2024
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antennas on Side Wall of 3D Stacked Die
- Publication number 20240039141
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Side Wall Interconnection
- Publication number 20240038724
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Dielectric Materials for Improving Signal Integrity of Integr...
- Publication number 20230395444
- Publication date Dec 7, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Heterogeneous Area Array Interconnections
- Publication number 20230369267
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20230367087
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Cantilevered Power Planes to Provide a Return Current Path for High...
- Publication number 20230369191
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Cores, Variable Width Vias, and Offset Vias
- Publication number 20230352383
- Publication date Nov 2, 2023
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION ARRAY DEVICE WITH SUPPORT
- Publication number 20230230889
- Publication date Jul 20, 2023
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...
- Publication number 20200105698
- Publication date Apr 2, 2020
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...
- Publication number 20190123007
- Publication date Apr 25, 2019
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN RECON INTERPOSER PACKAGE WITHOUT TSV FOR FINE INPUT/OUTPUT PIT...
- Publication number 20180308791
- Publication date Oct 25, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20180233440
- Publication date Aug 16, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY REDISTRIBUTION LAYER (RDL) INTERCONNECT BRIDGE USING A...
- Publication number 20170365565
- Publication date Dec 21, 2017
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SYSTEM IN PACKAGE (SIP) USING A RECONSTITUTED WAFER AND...
- Publication number 20170301651
- Publication date Oct 19, 2017
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-out 3D IC Integration Structure without Substrate and Method of...
- Publication number 20170117251
- Publication date Apr 27, 2017
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreader Having Thermal Interface Material Retainment
- Publication number 20170110384
- Publication date Apr 20, 2017
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Recon Interposer Package Without TSV for Fine Input/Output Pit...
- Publication number 20170011993
- Publication date Jan 12, 2017
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method to Monitor Thermal Runaway in a Semiconductor...
- Publication number 20170003339
- Publication date Jan 5, 2017
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device with a Vertical Channel Formed Through a Plura...
- Publication number 20160308042
- Publication date Oct 20, 2016
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES
- Publication number 20160190057
- Publication date Jun 30, 2016
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Sam Ziqun Zhao

Person

Patents Grantslast 30 patents

Cantilevered power planes to provide a return current path for high...

Photonics integration in semiconductor packages

Redistribution metal and under bump metal interconnect structures a...

Thin recon interposer package without TSV for fine input/output pit...

Redistribution metal and under bump metal interconnect structures a...

High density redistribution layer (RDL) interconnect bridge using a...

Heat spreader having thermal interface material retainment

Locating wireless-enabled components and applications thereof

Thin recon interposer package without TSV for fine input/output pit...

Wireless bus for intra-chip and inter-chip communication, including...

Wafer level system in package (SiP) using a reconstituted wafer and...

Fan-out 3D IC integration structure without substrate and method of...

Wireless bus for intra-chip and inter-chip communication, including...

Vehicle decklid

Vehicle grille

Vehicle grille

Magnetic-core three-dimensional (3D) inductors and packaging integr...

Semiconductor device with a variable-width vertical channel formed...

Vehicle front bumper

Apparatus and method to monitor thermal runaway in a semiconductor...

Wireless bus for intra-chip and inter-chip communication, including...

Wireless communicating among vertically arranged integrated circuit...

Vehicle hood

Semiconductor interposer having a cavity for intra-interposer die

Vehicle rear fascia

Hybrid thermal interface material for IC packages with integrated h...

Creating a system on the fly and applications thereof

Vehicle body exterior

Semiconductor package with a bridge interposer

Compliant dielectric layer for semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE BACKSIDE POWER DISTRIBUTION NETWORK STRUCTURE...

CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...

PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

Photonics Integration in Semiconductor Packages

Substrate with Differing Dielectric Constants

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

Edge Seal for Bonded Stacks of Different Size Semiconductor Devices

Elastomer Interconnection Substrate Layer

Semiconductor Package Interconnection Structure

STRESS AND WARPAGE IMPROVEMENTS FOR STIFFENER RING PACKAGE WITH EXP...

Integrated Antennas on Side Wall of 3D Stacked Die

Semiconductor Package with Side Wall Interconnection

Mixed Dielectric Materials for Improving Signal Integrity of Integr...

3D Packaging Heterogeneous Area Array Interconnections

Photonics Integration in Semiconductor Packages

Cantilevered Power Planes to Provide a Return Current Path for High...

Multilayer Cores, Variable Width Vias, and Offset Vias

INTERCONNECTION ARRAY DEVICE WITH SUPPORT

REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...

REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...

THIN RECON INTERPOSER PACKAGE WITHOUT TSV FOR FINE INPUT/OUTPUT PIT...

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

HIGH DENSITY REDISTRIBUTION LAYER (RDL) INTERCONNECT BRIDGE USING A...

WAFER LEVEL SYSTEM IN PACKAGE (SIP) USING A RECONSTITUTED WAFER AND...

Fan-out 3D IC Integration Structure without Substrate and Method of...

Heat Spreader Having Thermal Interface Material Retainment

Thin Recon Interposer Package Without TSV for Fine Input/Output Pit...

Apparatus and Method to Monitor Thermal Runaway in a Semiconductor...

Semiconductor Device with a Vertical Channel Formed Through a Plura...

INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES