Samantha Tan

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective processing with etch residue-based inhibitors
- Patent number 12,131,909
- Issue date Oct 29, 2024
- Lam Research Corporation
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etching chemistries of high aspect ratio features in dielect...
- Patent number 12,119,243
- Issue date Oct 15, 2024
- Lam Research Corporation
- Keren J. Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist development with halide chemistries
- Patent number 12,105,422
- Issue date Oct 1, 2024
- Lam Research Corporation
- Samantha Siamhwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 12,094,711
- Issue date Sep 17, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch and ion beam etch patterning
- Patent number 12,080,562
- Issue date Sep 3, 2024
- Lam Research Corporation
- Samantha Siamhwa Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High etch selectivity, low stress ashable carbon hard mask
- Patent number 12,062,537
- Issue date Aug 13, 2024
- Lam Research Corporation
- Jun Xue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer etch and selective deposition process for extreme ultr...
- Patent number 12,062,538
- Issue date Aug 13, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective carbon deposition
- Patent number 12,037,686
- Issue date Jul 16, 2024
- Lam Research Corporation
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective etch using a sacrificial mask
- Patent number 12,027,375
- Issue date Jul 2, 2024
- Lam Research Corporation
- Daniel Peter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underlayer for photoresist adhesion and dose reduction
- Patent number 11,988,965
- Issue date May 21, 2024
- Lam Research Corporation
- Samantha S. H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer etching for subtractive metal etch
- Patent number 11,935,758
- Issue date Mar 19, 2024
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating etch and passivation process
- Patent number 11,848,212
- Issue date Dec 19, 2023
- Lam Research Corporation
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing metal contamination from surfaces of a processing chamber
- Patent number 11,842,888
- Issue date Dec 12, 2023
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective processing with etch residue-based inhibitors
- Patent number 11,823,909
- Issue date Nov 21, 2023
- Lam Research Corporation
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-containing passivation for high aspect ratio etch
- Patent number 11,670,516
- Issue date Jun 6, 2023
- Lam Research Corporation
- Karthik S. Colinjivadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching chemistries of high aspect ratio features in dielect...
- Patent number 11,594,429
- Issue date Feb 28, 2023
- Lam Research Corporation
- Keren J. Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating etch and passivation process
- Patent number 11,551,938
- Issue date Jan 10, 2023
- Lam Research Corporation
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively etching for nanowires
- Patent number 11,521,860
- Issue date Dec 6, 2022
- Lam Research Corporation
- Jun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of self assembled monolayer for enabling selective depos...
- Patent number 11,450,532
- Issue date Sep 20, 2022
- Lam Research Corporation
- Younghee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching and smoothing of refractory metals and other h...
- Patent number 11,450,513
- Issue date Sep 20, 2022
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 11,355,353
- Issue date Jun 7, 2022
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 11,322,351
- Issue date May 3, 2022
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underlayer for photoresist adhesion and dose reduction
- Patent number 11,314,168
- Issue date Apr 26, 2022
- Lam Research Corporation
- Samantha S. H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Eliminating yield impact of stochastics in lithography
- Patent number 11,257,674
- Issue date Feb 22, 2022
- Lam Research Corporation
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch of tungsten for enhanced tungsten deposition fill
- Patent number 11,069,535
- Issue date Jul 20, 2021
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal doped carbon based hard mask removal in semiconductor fabrica...
- Patent number 11,062,897
- Issue date Jul 13, 2021
- Lam Research Corporation
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capped ALD films for doping fin-shaped channel regions of 3-D IC tr...
- Patent number 11,011,379
- Issue date May 18, 2021
- Lam Research Corporation
- Reza Arghavani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directional deposition on patterned structures
- Patent number 10,825,680
- Issue date Nov 3, 2020
- Lam Research Corporation
- Alexander Kabansky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Eliminating yield impact of stochastics in lithography
- Patent number 10,796,912
- Issue date Oct 6, 2020
- Lam Research Corporation
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High energy atomic layer etching
- Patent number 10,763,083
- Issue date Sep 1, 2020
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-STEP POST-EXPOSURE TREATMENT TO IMPROVE DRY DEVELOPMENT PERFO...
- Publication number 20240329539
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Samantha SiamHwa TAN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CYCLIC DEVELOPMENT OF METAL OXIDE BASED PHOTORESIST FOR ETCH STOP D...
- Publication number 20240329538
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Da Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HIGH ENERGY ATOMIC LAYER ETCHING
- Publication number 20240274408
- Publication date Aug 15, 2024
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240258127
- Publication date Aug 1, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION
- Publication number 20240255850
- Publication date Aug 1, 2024
- LAM RESEARCH CORPORATION
- Samantha S.H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240258128
- Publication date Aug 1, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240203759
- Publication date Jun 20, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240203760
- Publication date Jun 20, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND PROCESS FOR EUV DRY RESIST SENSITIZATION BY GAS PHASE...
- Publication number 20240192590
- Publication date Jun 13, 2024
- LAM RESEARCH CORPORATION
- Sivananda Krishnan Kanakasabapathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCH
- Publication number 20240186150
- Publication date Jun 6, 2024
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240178014
- Publication date May 30, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...
- Publication number 20240145272
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER
- Publication number 20240112896
- Publication date Apr 4, 2024
- LAM RESEARCH CORPORATION
- Jengyi YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING ETCH AND PASSIVATION PROCESS
- Publication number 20240087904
- Publication date Mar 14, 2024
- LAM RESEARCH CORPORATION
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF METALLIC CONTAMINATION FROM METAL-CONTAINING PHOTORESIST
- Publication number 20240036474
- Publication date Feb 1, 2024
- LAM RESEARCH CORPORATION
- Daniel PETER
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20240038539
- Publication date Feb 1, 2024
- LAM RESEARCH CORPORATION
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL ETCH
- Publication number 20240021435
- Publication date Jan 18, 2024
- LAM RESEARCH CORPORATION
- Yiwen FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST
- Publication number 20230314954
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Daniel PETER
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF FORMING PHOTO-SENSITIVE HYBRID FILMS
- Publication number 20230314946
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Eric Calvin Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE COPPER ETCH
- Publication number 20230298869
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...
- Publication number 20230290657
- Publication date Sep 14, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFICATION FOR METAL-CONTAINING PHOTORESIST DEPOSITION
- Publication number 20230230811
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING A CHAMBER
- Publication number 20230230819
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Ran LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING ETCH AND PASSIVATION PROCESS
- Publication number 20230197459
- Publication date Jun 22, 2023
- LAM RESEARCH CORPORATION
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20230187234
- Publication date Jun 15, 2023
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER
- Publication number 20230148265
- Publication date May 11, 2023
- LAM RESEARCH CORPORATION
- Jengyi YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE ETCH USING DEPOSITION OF A METALLOID OR METAL CONTAINING...
- Publication number 20230118701
- Publication date Apr 20, 2023
- LAM RESEARCH CORPORATION
- Samantha SiamHwa TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FILM ETCH
- Publication number 20230047486
- Publication date Feb 16, 2023
- LAM RESEARCH CORPORATION
- Younghee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...
- Publication number 20230045336
- Publication date Feb 9, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST APPLICATION/EXPOSURE TREATMENTS TO IMPROVE DRY DEVELOPMENT PER...
- Publication number 20230031955
- Publication date Feb 2, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS

Samantha Tan

Person

Patents Grantslast 30 patents

Selective processing with etch residue-based inhibitors

Plasma etching chemistries of high aspect ratio features in dielect...

Photoresist development with halide chemistries

Tin oxide films in semiconductor device manufacturing

Atomic layer etch and ion beam etch patterning

High etch selectivity, low stress ashable carbon hard mask

Atomic layer etch and selective deposition process for extreme ultr...

Selective carbon deposition

Selective etch using a sacrificial mask

Underlayer for photoresist adhesion and dose reduction

Atomic layer etching for subtractive metal etch

Alternating etch and passivation process

Removing metal contamination from surfaces of a processing chamber

Selective processing with etch residue-based inhibitors

Metal-containing passivation for high aspect ratio etch

Plasma etching chemistries of high aspect ratio features in dielect...

Alternating etch and passivation process

Selectively etching for nanowires

Deposition of self assembled monolayer for enabling selective depos...

Atomic layer etching and smoothing of refractory metals and other h...

Tin oxide mandrels in patterning

Tin oxide films in semiconductor device manufacturing

Underlayer for photoresist adhesion and dose reduction

Eliminating yield impact of stochastics in lithography

Atomic layer etch of tungsten for enhanced tungsten deposition fill

Metal doped carbon based hard mask removal in semiconductor fabrica...

Capped ALD films for doping fin-shaped channel regions of 3-D IC tr...

Directional deposition on patterned structures

Eliminating yield impact of stochastics in lithography

High energy atomic layer etching

Patents Applicationslast 30 patents

MULTI-STEP POST-EXPOSURE TREATMENT TO IMPROVE DRY DEVELOPMENT PERFO...

CYCLIC DEVELOPMENT OF METAL OXIDE BASED PHOTORESIST FOR ETCH STOP D...

HIGH ENERGY ATOMIC LAYER ETCHING

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

APPARATUS AND PROCESS FOR EUV DRY RESIST SENSITIZATION BY GAS PHASE...

ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCH

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...

REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER

ALTERNATING ETCH AND PASSIVATION PROCESS

CONTROL OF METALLIC CONTAMINATION FROM METAL-CONTAINING PHOTORESIST

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

METAL ETCH

DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST

METHOD OF FORMING PHOTO-SENSITIVE HYBRID FILMS

SUBTRACTIVE COPPER ETCH

INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...

SURFACE MODIFICATION FOR METAL-CONTAINING PHOTORESIST DEPOSITION

METHOD FOR CLEANING A CHAMBER

ALTERNATING ETCH AND PASSIVATION PROCESS

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER

SELECTIVE ETCH USING DEPOSITION OF A METALLOID OR METAL CONTAINING...

ALLOY FILM ETCH

INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...

POST APPLICATION/EXPOSURE TREATMENTS TO IMPROVE DRY DEVELOPMENT PER...