Sameer Deshpande

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing system apparatus and methods for defect reduction at a su...
- Patent number 12,138,732
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Asheesh Jain
- B24 - GRINDING POLISHING
Information Patent Grant
Pad conditioner cut rate monitoring
- Patent number 11,577,362
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G01 - MEASURING TESTING
Information Patent Grant
Configuration of peered cluster storage environment organized as di...
- Patent number 9,928,148
- Issue date Mar 27, 2018
- NetApp, Inc.
- Harihara Kadayam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Monitoring retaining ring thickness and pressure control
- Patent number 9,067,295
- Issue date Jun 30, 2015
- Applied Materials, Inc.
- Sameer Deshpande
- B24 - GRINDING POLISHING
Information Patent Grant
Closed-loop control for effective pad conditioning
- Patent number 8,337,279
- Issue date Dec 25, 2012
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
In-situ performance prediction of pad conditioning disk by closed l...
- Patent number 8,096,852
- Issue date Jan 17, 2012
- Applied Materials, Inc.
- Sameer Deshpande
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PAD SURFACE CLEANING DEVICE AROUND PAD CONDITIONER TO ENABLE INSITU...
- Publication number 20240066664
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Shou-Sung CHANG
- B08 - CLEANING
Information Patent Application
CLEANING OF CMP TEMPERATURE CONTROL SYSTEM
- Publication number 20240042570
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
PAD CONDITIONER CUT RATE MONITORING
- Publication number 20230182264
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
SELF-ALIGNED WIDE BACKSIDE POWER RAIL CONTACTS TO MULTIPLE TRANSIST...
- Publication number 20230064183
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER RAIL TO DEEP VIAS
- Publication number 20230068312
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ULTRA THINNING OF WAFER
- Publication number 20230061392
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE SLURRY DISPENSE SYSTEM
- Publication number 20220193858
- Publication date Jun 23, 2022
- Applied Materials, Inc.
- Sameer DESHPANDE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLISHING SYSTEM APPARATUS AND METHODS FOR DEFECT REDUCTION AT A SU...
- Publication number 20220184771
- Publication date Jun 16, 2022
- Applied Materials, Inc.
- Asheesh JAIN
- B24 - GRINDING POLISHING
Information Patent Application
Pad Conditioner Cut Rate Monitoring
- Publication number 20190283208
- Publication date Sep 19, 2019
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
CONFIGURATION OF PEERED CLUSTER STORAGE ENVIRONMENT ORGANIZED AS DI...
- Publication number 20160057009
- Publication date Feb 25, 2016
- NetApp, Inc.
- Harihara Kadayam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Monitoring Retaining Ring Thickness And Pressure Control
- Publication number 20140027407
- Publication date Jan 30, 2014
- Sameer Deshpande
- B24 - GRINDING POLISHING
Information Patent Application
MEASUREMENT OF PAD THICKNESS AND CONTROL OF CONDITIONING
- Publication number 20120270477
- Publication date Oct 25, 2012
- Roy C. Nangoy
- B24 - GRINDING POLISHING
Information Patent Application
IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED L...
- Publication number 20100035525
- Publication date Feb 11, 2010
- SAMEER Deshpande
- B24 - GRINDING POLISHING
Information Patent Application
CLOSED-LOOP CONTROL FOR EFFECTIVE PAD CONDITIONING
- Publication number 20090318060
- Publication date Dec 24, 2009
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING

Sameer Deshpande

Person

Patents Grantslast 30 patents

Polishing system apparatus and methods for defect reduction at a su...

Pad conditioner cut rate monitoring

Configuration of peered cluster storage environment organized as di...

Monitoring retaining ring thickness and pressure control

Closed-loop control for effective pad conditioning

In-situ performance prediction of pad conditioning disk by closed l...

Patents Applicationslast 30 patents

PAD SURFACE CLEANING DEVICE AROUND PAD CONDITIONER TO ENABLE INSITU...

CLEANING OF CMP TEMPERATURE CONTROL SYSTEM

PAD CONDITIONER CUT RATE MONITORING

SELF-ALIGNED WIDE BACKSIDE POWER RAIL CONTACTS TO MULTIPLE TRANSIST...

BACKSIDE POWER RAIL TO DEEP VIAS

METHOD OF ULTRA THINNING OF WAFER

ADAPTIVE SLURRY DISPENSE SYSTEM

POLISHING SYSTEM APPARATUS AND METHODS FOR DEFECT REDUCTION AT A SU...

Pad Conditioner Cut Rate Monitoring

CONFIGURATION OF PEERED CLUSTER STORAGE ENVIRONMENT ORGANIZED AS DI...

Monitoring Retaining Ring Thickness And Pressure Control

MEASUREMENT OF PAD THICKNESS AND CONTROL OF CONDITIONING

IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED L...

CLOSED-LOOP CONTROL FOR EFFECTIVE PAD CONDITIONING