Sameer S. Vadhavkar

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,735,549
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-last methods for forming semiconductor devices
- Patent number 11,631,630
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 11,139,258
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,081,460
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-last methods for forming semiconductor devices
- Patent number 10,957,625
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for semiconductor die heat dissipation
- Patent number 10,916,527
- Issue date Feb 9, 2021
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,784,224
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for semiconductor die heat dissipation
- Patent number 10,770,435
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,748,878
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 10,580,746
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 10,573,612
- Issue date Feb 25, 2020
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,559,551
- Issue date Feb 11, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state radiation transducer devices having flip-chip mounted s...
- Patent number 10,541,355
- Issue date Jan 21, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for semiconductor die heat dissipation
- Patent number 10,541,229
- Issue date Jan 21, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for semiconductor die heat dissipation
- Patent number 10,461,061
- Issue date Oct 29, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for semiconductor die heat dissipation
- Patent number 10,438,928
- Issue date Oct 8, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,424,553
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,297,577
- Issue date May 21, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 10,163,830
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 10,163,755
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state radiation transducer devices having flip-chip mounted s...
- Patent number 10,079,333
- Issue date Sep 18, 2018
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 9,837,396
- Issue date Dec 5, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 9,780,052
- Issue date Oct 3, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 9,768,149
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 9,691,746
- Issue date Jun 27, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state radiation transducer devices having flip-chip mounted s...
- Patent number 9,647,167
- Issue date May 9, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 9,515,002
- Issue date Dec 6, 2016
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 9,443,744
- Issue date Sep 13, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with underfill containment cavity
- Patent number 9,397,078
- Issue date Jul 19, 2016
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...
- Publication number 20210343670
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES
- Publication number 20210166996
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR SEMICONDUCTOR DIE HEAT DISSIPATION
- Publication number 20200350294
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- SAMEER S. VADHAVKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...
- Publication number 20200211993
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20200176404
- Publication date Jun 4, 2020
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE RADIATION TRANSDUCER DEVICES HAVING FLIP-CHIP MOUNTED S...
- Publication number 20200098965
- Publication date Mar 26, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20190371755
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20190348401
- Publication date Nov 14, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR SEMICONDUCTOR DIE HEAT DISSIPATION
- Publication number 20190326260
- Publication date Oct 24, 2019
- Micron Technology, Inc.
- SAMEER S. VADHAVKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20190229096
- Publication date Jul 25, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES
- Publication number 20190206766
- Publication date Jul 4, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR SEMICONDUCTOR DIE HEAT DISSIPATION
- Publication number 20190172817
- Publication date Jun 6, 2019
- Micron Technology, Inc.
- SAMEER S. VADHAVKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20180374810
- Publication date Dec 27, 2018
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20180358314
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE RADIATION TRANSDUCER DEVICES HAVING FLIP-CHIP MOUNTED S...
- Publication number 20180358526
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20180308785
- Publication date Oct 25, 2018
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20180122762
- Publication date May 3, 2018
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20170365584
- Publication date Dec 21, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20170352633
- Publication date Dec 7, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20170229439
- Publication date Aug 10, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE RADIATION TRANSDUCER DEVICES HAVING FLIP-CHIP MOUNTED S...
- Publication number 20170222111
- Publication date Aug 3, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20170077052
- Publication date Mar 16, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20170053881
- Publication date Feb 23, 2017
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20160372452
- Publication date Dec 22, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20160343687
- Publication date Nov 24, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR SEMICONDUCTOR DIE HEAT DISSIPATION
- Publication number 20160247742
- Publication date Aug 25, 2016
- Micron Technology, Inc.
- SAMEER S. VADHAVKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20160233139
- Publication date Aug 11, 2016
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS

Sameer S. Vadhavkar

Person

Patents Grantslast 30 patents

Methods of manufacturing stacked semiconductor die assemblies with...

Methods and systems for manufacturing pillar structures on semicond...

Pillar-last methods for forming semiconductor devices

Bonding pads with thermal pathways

Methods and systems for manufacturing pillar structures on semicond...

Pillar-last methods for forming semiconductor devices

Apparatuses and methods for semiconductor die heat dissipation

Semiconductor devices with underfill control features, and associat...

Apparatuses and methods for semiconductor die heat dissipation

Semiconductor device assembly with heat transfer structure formed f...

Bonding pads with thermal pathways

Bonding pads with thermal pathways

Semiconductor device assembly with heat transfer structure formed f...

Solid-state radiation transducer devices having flip-chip mounted s...

Apparatuses and methods for semiconductor die heat dissipation

Apparatuses and methods for semiconductor die heat dissipation

Apparatuses and methods for semiconductor die heat dissipation

Semiconductor devices with underfill control features, and associat...

Semiconductor device assembly with heat transfer structure formed f...

Bonding pads with thermal pathways

Methods of manufacturing stacked semiconductor die assemblies with...

Solid-state radiation transducer devices having flip-chip mounted s...

Stacked semiconductor die assemblies with high efficiency thermal p...

Collars for under-bump metal structures and associated systems and...

Semiconductor device assembly with heat transfer structure formed f...

Methods of manufacturing stacked semiconductor die assemblies with...

Solid-state radiation transducer devices having flip-chip mounted s...

Bonding pads with thermal pathways

Stacked semiconductor die assemblies with high efficiency thermal p...

Semiconductor device assembly with underfill containment cavity

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...

PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

APPARATUSES AND METHODS FOR SEMICONDUCTOR DIE HEAT DISSIPATION

METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...

BONDING PADS WITH THERMAL PATHWAYS

SOLID-STATE RADIATION TRANSDUCER DEVICES HAVING FLIP-CHIP MOUNTED S...

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

APPARATUSES AND METHODS FOR SEMICONDUCTOR DIE HEAT DISSIPATION

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES

APPARATUSES AND METHODS FOR SEMICONDUCTOR DIE HEAT DISSIPATION

BONDING PADS WITH THERMAL PATHWAYS

BONDING PADS WITH THERMAL PATHWAYS

SOLID-STATE RADIATION TRANSDUCER DEVICES HAVING FLIP-CHIP MOUNTED S...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

SOLID-STATE RADIATION TRANSDUCER DEVICES HAVING FLIP-CHIP MOUNTED S...

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

BONDING PADS WITH THERMAL PATHWAYS

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

APPARATUSES AND METHODS FOR SEMICONDUCTOR DIE HEAT DISSIPATION

BONDING PADS WITH THERMAL PATHWAYS