Samit Sengupta

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrostatic discharge (ESD) protection device for use with multip...
- Patent number 8,217,457
- Issue date Jul 10, 2012
- Altera Corporation
- Samit Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge (ESD) protection device for use with multip...
- Patent number 7,468,617
- Issue date Dec 23, 2008
- Altera Corporation
- Samit Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for monitoring and replacing circuits to maintain high p...
- Patent number 7,286,020
- Issue date Oct 23, 2007
- Altera Corporation
- Hugh Sungki O
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuits with temperature-change and threshold-voltage d...
- Patent number 6,933,869
- Issue date Aug 23, 2005
- Altera Corporation
- Greg Starr
- G11 - INFORMATION STORAGE
Information Patent Grant
Compositions for improving interconnect metallization performance i...
- Patent number 6,459,153
- Issue date Oct 1, 2002
- Koninklijke Philips Electronics N.V.
- Samit S. Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with misaligned via hole
- Patent number 6,433,433
- Issue date Aug 13, 2002
- Koninklijke Philips Electronics N.V.
- Samit Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with anti-reflective structure and methods of...
- Patent number 6,410,421
- Issue date Jun 25, 2002
- Koninklijke Philips Electronics N.V.
- Kouros Ghandehari
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Optimized metal etch process to enable the use of aluminum plugs
- Patent number 6,255,226
- Issue date Jul 3, 2001
- Philips Semiconductor, Inc.
- Tammy Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming isolation areas with improved isolation oxide
- Patent number 6,235,609
- Issue date May 22, 2001
- Philips Electronics North America Corp.
- Samit Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming metal interconnects with reduced or eliminated...
- Patent number 6,228,757
- Issue date May 8, 2001
- Philips Semiconductors, Inc.
- Samit Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated process for ashing resist and treating silicon after mas...
- Patent number 6,207,565
- Issue date Mar 27, 2001
- VLSI Technology, Inc.
- Edward K. Yeh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods of forming a semiconductor device
- Patent number 6,176,983
- Issue date Jan 23, 2001
- VLSI Technology, Inc.
- Subhas Bothra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for substantially preventing footings in chemically amplifie...
- Patent number 6,162,586
- Issue date Dec 19, 2000
- Philips Electronics North America Corp.
- Samit S. Sengupta
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device with conductive via and method of making same
- Patent number 6,146,996
- Issue date Nov 14, 2000
- Philips Electronics North America Corp.
- Samit Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with anti-reflective structure
- Patent number 6,057,587
- Issue date May 2, 2000
- VLSI Technology, Inc.
- Kouros Ghandehari
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for producing deep submicron interconnect vias
- Patent number 5,915,203
- Issue date Jun 22, 1999
- VLSI Technology, Inc.
- Samit Sengupta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITIONS FOR IMPROVING INTERCONNECT METALLIZATION PERFORMANCE I...
- Publication number 20020030275
- Publication date Mar 14, 2002
- SAMIT S. SENGUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device having metal interconnects with reduced or eliminated metal...
- Publication number 20010017416
- Publication date Aug 30, 2001
- VLSI TECHNOLOGY, INC.
- Samit Sengupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized metal etch process to enable the use of aluminum plugs
- Publication number 20010012690
- Publication date Aug 9, 2001
- Philips Semiconductors, Inc.
- Tammy Zheng
- H01 - BASIC ELECTRIC ELEMENTS

Samit Sengupta

Person

Patents Grantslast 30 patents

Electrostatic discharge (ESD) protection device for use with multip...

Electrostatic discharge (ESD) protection device for use with multip...

Techniques for monitoring and replacing circuits to maintain high p...

Integrated circuits with temperature-change and threshold-voltage d...

Compositions for improving interconnect metallization performance i...

Semiconductor device with misaligned via hole

Semiconductor device with anti-reflective structure and methods of...

Optimized metal etch process to enable the use of aluminum plugs

Method for forming isolation areas with improved isolation oxide

Process for forming metal interconnects with reduced or eliminated...

Integrated process for ashing resist and treating silicon after mas...

Methods of forming a semiconductor device

Method for substantially preventing footings in chemically amplifie...

Semiconductor device with conductive via and method of making same

Semiconductor device with anti-reflective structure

Method for producing deep submicron interconnect vias

Patents Applicationslast 30 patents

COMPOSITIONS FOR IMPROVING INTERCONNECT METALLIZATION PERFORMANCE I...

Device having metal interconnects with reduced or eliminated metal...

Optimized metal etch process to enable the use of aluminum plugs