Sampath Purushothaman

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,796,958
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,777,454
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 10,767,084
- Issue date Sep 8, 2020
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,651,086
- Issue date May 12, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced via fill material and processing for dual damscene integra...
- Patent number 10,340,182
- Issue date Jul 2, 2019
- International Business Machines Corporation
- James P. Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 9,994,741
- Issue date Jun 12, 2018
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Three-dimensional integrated circuit device fabrication including w...
- Patent number 9,412,620
- Issue date Aug 9, 2016
- GLOBALFOUNDRIES Inc.
- Douglas C. La Tulipe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping coating for 3D integration applications
- Patent number 9,218,956
- Issue date Dec 22, 2015
- GLOBALFOUNDRIES Inc.
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for enhanced 3D integration and structures generated using...
- Patent number 9,111,925
- Issue date Aug 18, 2015
- International Business Machines Corporation
- Evan George Colgan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corrugated interfaces for multilayered interconnects
- Patent number 9,089,080
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Lawrence A. Clevenger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lock and key through-via method for wafer level 3D integration and...
- Patent number 9,064,717
- Issue date Jun 23, 2015
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit device using a wafer scale mem...
- Patent number 8,963,278
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer readable medium encoded with a program for fabricating 3D...
- Patent number 8,962,448
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of substrates including metal-dielectric patterns with meta...
- Patent number 8,927,087
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capping coating for 3D integration applications
- Patent number 8,912,050
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with engineered dielectrics with nanocolumn...
- Patent number 8,901,741
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Matthew E. Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrugated interfaces for multilayered interconnects
- Patent number 8,828,521
- Issue date Sep 9, 2014
- International Business Machines Corporation
- Lawrence A. Clevenger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capping coating for 3D integration applications
- Patent number 8,778,736
- Issue date Jul 15, 2014
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit device fabrication with precisely controllabl...
- Patent number 8,738,167
- Issue date May 27, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating 3D integrated circuit device using interface...
- Patent number 8,664,081
- Issue date Mar 4, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale membrane for three-dimensional integrated circuit devic...
- Patent number 8,637,953
- Issue date Jan 28, 2014
- International Business Machines Corporation
- Douglas C. La Tulipe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3D integrated circuit device fabrication with precisely controllabl...
- Patent number 8,629,553
- Issue date Jan 14, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Homogeneous porous low dielectric constant materials
- Patent number 8,623,741
- Issue date Jan 7, 2014
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of substrates including metal-dielectric patterns with meta...
- Patent number 8,617,689
- Issue date Dec 31, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for enhanced 3D integration and structures generated using...
- Patent number 8,600,202
- Issue date Dec 3, 2013
- International Business Machines Corporation
- Evan G. Colgan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High memory density, high input/output bandwidth logic-memory struc...
- Patent number 8,569,874
- Issue date Oct 29, 2013
- International Business Machines Corporation
- Evan G. Colgan
- G11 - INFORMATION STORAGE
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 8,563,396
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable via devices
- Patent number 8,525,144
- Issue date Sep 3, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned dual damascene BEOL structures with patternable low- K...
- Patent number 8,519,540
- Issue date Aug 27, 2013
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20200165494
- Publication date May 28, 2020
- International Business Machines Corporation
- James L. Hedrick
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20190378781
- Publication date Dec 12, 2019
- International Business Machines Corporation
- James L. Hedrick
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20180374751
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20180340100
- Publication date Nov 29, 2018
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180337091
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180315655
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED VIA FILL MATERIAL AND PROCESSING FOR DUAL DAMASCENE INTEGR...
- Publication number 20180138084
- Publication date May 17, 2018
- International Business Machines Corporation
- James P. Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel 3D Integration Method Using SOI Substrates And Structures Pro...
- Publication number 20170271207
- Publication date Sep 21, 2017
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20170229392
- Publication date Aug 10, 2017
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20170166784
- Publication date Jun 15, 2017
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Application
ENHANCED VIA FILL MATERIAL AND PROCESSING FOR DUAL DAMSCENE...
- Publication number 20170154812
- Publication date Jun 1, 2017
- International Business Machines Corporation
- James P. DOYLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE FABRICATION INCLUDING W...
- Publication number 20150147869
- Publication date May 28, 2015
- International Business Machines Corporation
- Douglas C. LA TULIPE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Novel 3D Integration Method Using SOI Substrates And Structures Pro...
- Publication number 20150054149
- Publication date Feb 26, 2015
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING 3D...
- Publication number 20150024548
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING COATING FOR 3D INTEGRATION APPLICATIONS
- Publication number 20150011072
- Publication date Jan 8, 2015
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20140097543
- Publication date Apr 10, 2014
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE USING A WAFER SCALE MEM...
- Publication number 20140077330
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Douglas C. LA TULIPE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20140021616
- Publication date Jan 23, 2014
- International Business Machines Corporation
- Diego Anzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20140024146
- Publication date Jan 23, 2014
- International Business Machines Corporation
- Diego Anzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process For Enhanced 3D Integration and Structures Generated Using...
- Publication number 20130341791
- Publication date Dec 26, 2013
- International Bushiness Machines Corporation
- Evan George Colgan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20130307139
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORRUGATED INTERFACES FOR MULTILAYERED INTERCONNECTS
- Publication number 20130273325
- Publication date Oct 17, 2013
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRUGATED INTERFACES FOR MULTILAYERED INTERCONNECTS
- Publication number 20130270224
- Publication date Oct 17, 2013
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING A...
- Publication number 20130189813
- Publication date Jul 25, 2013
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection of intermetal dielectric layers in multilevel wiring str...
- Publication number 20130056874
- Publication date Mar 7, 2013
- International Business Machines Corporation
- Maxime Darnon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH ENGINEERED DIELECTRICS WITH NANOCOLUMN...
- Publication number 20130009315
- Publication date Jan 10, 2013
- Matthew E. Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOMOGENEOUS POROUS LOW DIELECTRIC CONSTANT MATERIALS
- Publication number 20120329273
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Robert L. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO MITIGATE PLASMA DAMAGE IN ORGANOSILICATE DIELECTRICS
- Publication number 20120329269
- Publication date Dec 27, 2012
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping Coating for 3D Integration Applications
- Publication number 20120329244
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Enhanced 3D Integration and Structures Generated Using...
- Publication number 20120314994
- Publication date Dec 13, 2012
- International Business Machines Corporation
- Evan G. Colgan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Sampath Purushothaman

Person

Patents Grantslast 30 patents

Enhanced adhesive materials and processes for 3D applications

3D integration method using SOI substrates and structures produced...

3D integration method using SOI substrates and structures produced...

Enhanced adhesive materials and processes for 3D applications

3D integration method using SOI substrates and structures produced...

Enhanced via fill material and processing for dual damscene integra...

Enhanced adhesive materials and processes for 3D applications

Three-dimensional integrated circuit device fabrication including w...

Capping coating for 3D integration applications

Process for enhanced 3D integration and structures generated using...

Corrugated interfaces for multilayered interconnects

Lock and key through-via method for wafer level 3D integration and...

Three-dimensional integrated circuit device using a wafer scale mem...

Computer readable medium encoded with a program for fabricating 3D...

Bonding of substrates including metal-dielectric patterns with meta...

Capping coating for 3D integration applications

Interconnect structures with engineered dielectrics with nanocolumn...

Corrugated interfaces for multilayered interconnects

Capping coating for 3D integration applications

3D integrated circuit device fabrication with precisely controllabl...

Method for fabricating 3D integrated circuit device using interface...

Wafer scale membrane for three-dimensional integrated circuit devic...

3D integrated circuit device fabrication with precisely controllabl...

Homogeneous porous low dielectric constant materials

Bonding of substrates including metal-dielectric patterns with meta...

Process for enhanced 3D integration and structures generated using...

High memory density, high input/output bandwidth logic-memory struc...

3D integration method using SOI substrates and structures produced...

Programmable via devices

Self-aligned dual damascene BEOL structures with patternable low- K...

Patents Applicationslast 30 patents

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

Novel 3D Integration Method Using SOI Substrates and Structures Pro...

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

ENHANCED VIA FILL MATERIAL AND PROCESSING FOR DUAL DAMASCENE INTEGR...

Novel 3D Integration Method Using SOI Substrates And Structures Pro...

Novel 3D Integration Method Using SOI Substrates and Structures Pro...

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

ENHANCED VIA FILL MATERIAL AND PROCESSING FOR DUAL DAMSCENE...

THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE FABRICATION INCLUDING W...

Novel 3D Integration Method Using SOI Substrates And Structures Pro...

COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING 3D...

CAPPING COATING FOR 3D INTEGRATION APPLICATIONS

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...

THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE USING A WAFER SCALE MEM...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE

Process For Enhanced 3D Integration and Structures Generated Using...

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...

CORRUGATED INTERFACES FOR MULTILAYERED INTERCONNECTS

CORRUGATED INTERFACES FOR MULTILAYERED INTERCONNECTS

COMPUTER READABLE MEDIUM ENCODED WITH A PROGRAM FOR FABRICATING A...

Protection of intermetal dielectric layers in multilevel wiring str...

INTERCONNECT STRUCTURES WITH ENGINEERED DIELECTRICS WITH NANOCOLUMN...

HOMOGENEOUS POROUS LOW DIELECTRIC CONSTANT MATERIALS

METHODS TO MITIGATE PLASMA DAMAGE IN ORGANOSILICATE DIELECTRICS

Capping Coating for 3D Integration Applications

Process for Enhanced 3D Integration and Structures Generated Using...