Samson Berhane

Person

Corvallis, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Printing device
- Patent number 8,333,459
- Issue date Dec 18, 2012
- Hewlett-Packard Development Company, L.P.
- Rio Rivas
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid-ejection devices and a deposition method for layers thereof
- Patent number 7,517,060
- Issue date Apr 14, 2009
- Hewlett-Packard Development Company, L.P.
- Ulrich E. Hess
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of forming a through-substrate interconnect
- Patent number 7,432,582
- Issue date Oct 7, 2008
- Hewlett-Packard Development Company, L.P.
- Diane Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluid-ejection devices and a deposition method for layers thereof
- Patent number 7,025,894
- Issue date Apr 11, 2006
- Hewlett-Packard Development Company, L.P.
- Ulrich E. Hess
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of forming a through-substrate interconnect
- Patent number 6,902,872
- Issue date Jun 7, 2005
- Hewlett-Packard Development Company, L.P.
- Diane Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a through-substrate interconnect
- Patent number 6,716,737
- Issue date Apr 6, 2004
- Hewlett-Packard Development Company, L.P.
- Hubert Vander Plas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTING DEVICE
- Publication number 20110018938
- Publication date Jan 27, 2011
- Rio Rivas
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Fluid-ejection devices and a deposition method for layers thereof
- Publication number 20060125882
- Publication date Jun 15, 2006
- Ulrich E. Hess
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of forming a through-substrate interconnect
- Publication number 20050101040
- Publication date May 12, 2005
- Daine Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electroless deposition methods and systems
- Publication number 20050006339
- Publication date Jan 13, 2005
- Peter Mardilovich
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fluid-ejection devices and a deposition method for layers thereof
- Publication number 20040070649
- Publication date Apr 15, 2004
- Ulrich E. Hess
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF FORMING A THROUGH-SUBSTRATE INTERCONNECT
- Publication number 20040018712
- Publication date Jan 29, 2004
- Hubert Vander Plas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a through-substrate interconnect
- Publication number 20040017419
- Publication date Jan 29, 2004
- Diane Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Samson Berhane

Person

Patents Grantslast 30 patents

Printing device

Fluid-ejection devices and a deposition method for layers thereof

Method of forming a through-substrate interconnect

Fluid-ejection devices and a deposition method for layers thereof

Method of forming a through-substrate interconnect

Method of forming a through-substrate interconnect

Patents Applicationslast 30 patents

PRINTING DEVICE

Fluid-ejection devices and a deposition method for layers thereof

Method of forming a through-substrate interconnect

Electroless deposition methods and systems

Fluid-ejection devices and a deposition method for layers thereof

METHOD OF FORMING A THROUGH-SUBSTRATE INTERCONNECT

Method of forming a through-substrate interconnect