Samuel Ho

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Toronto, CA

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Patents Grantslast 30 patents

Information Patent Grant
Multi-die module
- Patent number 7,215,022
- Issue date May 8, 2007
- ATI Technologies Inc.
- Vincent Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-die module and method thereof
- Patent number 6,929,976
- Issue date Aug 16, 2005
- ATI Technologies, Inc.
- Vincent Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package for the transfer of heat generated by th...
- Patent number 6,849,940
- Issue date Feb 1, 2005
- ATI Technologies, Inc.
- Vincent K. Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-die module and method thereof
- Publication number 20040106230
- Publication date Jun 3, 2004
- Vincent Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct interconnect multi-chip module, method for making the same a...
- Publication number 20030089998
- Publication date May 15, 2003
- Vincent K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-die module and method thereof
- Publication number 20020195704
- Publication date Dec 26, 2002
- Vincent Chan
- H01 - BASIC ELECTRIC ELEMENTS