Samuel Jiang

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimentional packaging method and package structure of photoni...
- Patent number 11,789,218
- Issue date Oct 17, 2023
- Hangzhou Guangzhiyuan Technology Co., Ltd.
- Yichen Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENTIONAL PACKAGING METHOD AND PACKAGE STRUCTURE OF PHOTONI...
- Publication number 20220365295
- Publication date Nov 17, 2022
- Hangzhou Guangzhiyuan Technology Co., Ltd.
- Samuel Jiang
- H01 - BASIC ELECTRIC ELEMENTS