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Samuel McKnight
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New Paltz, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Silicon carrier space transformer and temporary chip attach burn-in...
Patent number
9,159,616
Issue date
Oct 13, 2015
International Business Machines Corporation
Harvey Hamel
G01 - MEASURING TESTING
Information
Patent Grant
Techniques for improving bond pad performance
Patent number
8,524,596
Issue date
Sep 3, 2013
International Business Machines Corporation
Frederic Beaulieu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon carrier space transformer and temporary chip attach burn-in...
Patent number
8,310,259
Issue date
Nov 13, 2012
International Business Machines Corporation
Harvey Hamel
G01 - MEASURING TESTING
Information
Patent Grant
Method for producing thermally matched probe assembly
Patent number
7,546,670
Issue date
Jun 16, 2009
International Business Machines Corporation
Timothy J. Dalton
G01 - MEASURING TESTING
Information
Patent Grant
Internally reinforced bond pads
Patent number
7,273,804
Issue date
Sep 25, 2007
International Business Machines Corporation
David Angell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density space transformer and method of fabricating same
Patent number
7,252,514
Issue date
Aug 7, 2007
International Business Machines Corporation
Samuel R. McKnight
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device having a composite layer in addition to a barr...
Patent number
6,960,831
Issue date
Nov 1, 2005
International Business Machines Corporation
Lloyd G. Burrell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Internally reinforced bond pads
Patent number
6,864,578
Issue date
Mar 8, 2005
International Business Machines Corporation
David Angell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temporary device attach structure for test and burn in of microjoin...
Patent number
6,747,472
Issue date
Jun 8, 2004
International Business Machines Corporation
John Harold Magerlein
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
SILICON CARRIER SPACE TRANSFORMER AND TEMPORARY CHIP ATTACH BURN-IN...
Publication number
20140235027
Publication date
Aug 21, 2014
International Business Machines Corporation
Harvey Hamel
G01 - MEASURING TESTING
Information
Patent Application
Techniques for Improving Bond Pad Performance
Publication number
20120279767
Publication date
Nov 8, 2012
International Business Machines Corporation
Frederic Beaulieu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARRIER SPACE TRANSFORMER AND TEMPORARY CHIP ATTACH BURN-IN...
Publication number
20120249173
Publication date
Oct 4, 2012
HARVEY HAMEL
G01 - MEASURING TESTING
Information
Patent Application
Methods of Creating Molds of Variable Solder Volumes for Flip Attach
Publication number
20090001248
Publication date
Jan 1, 2009
Matthew J. Farinelli
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of Creating Molds of Variable Solder Volumes for Flip Attach
Publication number
20090004840
Publication date
Jan 1, 2009
Matthew J. Farinelli
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
High density thermally matched contacting probe assembly and method...
Publication number
20070257689
Publication date
Nov 8, 2007
Timothy J. Dalton
G01 - MEASURING TESTING
Information
Patent Application
Device with area array pads for test probing
Publication number
20060249854
Publication date
Nov 9, 2006
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Techniques for improving bond pad performance
Publication number
20060244138
Publication date
Nov 2, 2006
International Business Machines Corporation
Frederic Beaulieu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High density space transformer and method of fabricating same
Publication number
20060046529
Publication date
Mar 2, 2006
Samuel R. McKnight
G01 - MEASURING TESTING
Information
Patent Application
DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
Publication number
20050167837
Publication date
Aug 4, 2005
International Business Machines Corporation
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Internally reinforced bond pads
Publication number
20050121803
Publication date
Jun 9, 2005
David Angell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having a composite layer in addition to a barr...
Publication number
20050067708
Publication date
Mar 31, 2005
International Business Machines Corporation
Lloyd G. Burrell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Internally reinforced bond pads
Publication number
20040195642
Publication date
Oct 7, 2004
David Angell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Temporary device attach structure for test and burn in of microjoin...
Publication number
20030136813
Publication date
Jul 24, 2003
International Business Machines Corporation
John Harold Magerlein
G01 - MEASURING TESTING
Information
Patent Application
Bond pad structure for integrated circuits
Publication number
20020070450
Publication date
Jun 13, 2002
Samuel McKnight
H01 - BASIC ELECTRIC ELEMENTS