TREA

Samuel R. Wennberg

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  • Kokomo, IN, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Solder joint encapsulation material
    • Patent number 5,759,730
    • Issue date Jun 2, 1998
    • Delco Electronics Corporation
    • Ralph D. Hermansen
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Hot melt epoxy encapsulation material
    • Patent number 5,708,056
    • Issue date Jan 13, 1998
    • Delco Electronics Corporation
    • Theresa Renee Lindley
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...