Samuel S. S. Choi

Person

Hopewell Juction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact formation for vertical field effect transistors
- Patent number 11,908,944
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed interconnet line having a low-oxygen cap for facilitating...
- Patent number 10,832,946
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Samuel Sung Shik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having subtractive etch feature and damascen...
- Patent number 10,256,186
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming air gap
- Patent number 10,224,236
- Issue date Mar 5, 2019
- GLOBALFOUNDRIES Inc.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned via fuse
- Patent number 10,186,482
- Issue date Jan 22, 2019
- GLOBALFOUNDRIES Inc.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive etch interconnects
- Patent number 10,177,031
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting a void between a via and a wiring line
- Patent number 10,103,068
- Issue date Oct 16, 2018
- GLOBALFOUNDRIES Inc.
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Grant
Back-end electrically programmable fuse
- Patent number 9,893,011
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having substractive etch feature and damasce...
- Patent number 9,852,980
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration process to form microelectronic or micromechanical stru...
- Patent number 9,755,016
- Issue date Sep 5, 2017
- GLOBALFOUNDRIES Inc.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end electrically programmable fuse
- Patent number 9,685,404
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having subtractive etch feature and damascen...
- Patent number 9,601,426
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance refractory metal / copper interconnects to elimina...
- Patent number 9,536,830
- Issue date Jan 3, 2017
- GLOBALFOUNDRIES Inc.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with air gap crack stop
- Patent number 9,536,842
- Issue date Jan 3, 2017
- GLOBALFOUNDRIES, INC.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect scaling method including forming dielectric layer over...
- Patent number 9,502,350
- Issue date Nov 22, 2016
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,455,186
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-metal E-fuse
- Patent number 9,431,346
- Issue date Aug 30, 2016
- GLOBALFOUNDRIES, INC.
- Junjing Bao
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Alternate dual damascene method for forming interconnects
- Patent number 9,431,292
- Issue date Aug 30, 2016
- GLOBALFOUNDRIES Inc.
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal fuse structure for improved programming capability
- Patent number 9,425,144
- Issue date Aug 23, 2016
- GLOBALFOUNDRIES, INC.
- Griselda Bonilla
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,406,560
- Issue date Aug 2, 2016
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,385,038
- Issue date Jul 5, 2016
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming microelectronic or micromechanical structures
- Patent number 9,337,261
- Issue date May 10, 2016
- GLOBALFOUNDRIES, INC.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure having a graphene-based barrie...
- Patent number 9,324,634
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Junjing Bao
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Modified via bottom for beol via efuse
- Patent number 9,324,655
- Issue date Apr 26, 2016
- GLOBALFOUNDRIES Inc.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure having a graphene-based barrie...
- Patent number 9,324,635
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Junjing Bao
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Graphene and metal interconnects with reduced contact resistance
- Patent number 9,293,412
- Issue date Mar 22, 2016
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid graphene-metal interconnect structures
- Patent number 9,257,391
- Issue date Feb 9, 2016
- GLOBALFOUNDRIES, INC.
- Junjing Bao
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Self-aligned via fuse
- Patent number 9,240,376
- Issue date Jan 19, 2016
- GLOBALFOUNDRIES Inc.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene and metal interconnects
- Patent number 9,202,743
- Issue date Dec 1, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
E-fuse with hybrid metallization
- Patent number 9,171,801
- Issue date Oct 27, 2015
- GlobalFoundries U.S. 2 LLC
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUB-EUV PATTERNING HEATERS FOR BAR MUSHROOM CELL PCM
- Publication number 20240090353
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Samuel Sung Shik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION FOR VERTICAL FIELD EFFECT TRANSISTORS
- Publication number 20230082449
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED INTERCONNET LINE HAVING A LOW-OXYGEN CAP FOR FACILITATING...
- Publication number 20200343131
- Publication date Oct 29, 2020
- International Business Machines Corporation
- Samuel Sung, Shik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AIR GAP
- Publication number 20180076082
- Publication date Mar 15, 2018
- GLOBALFOUNDRIES INC.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SCALING
- Publication number 20180076133
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AIR GAP
- Publication number 20170365504
- Publication date Dec 21, 2017
- GLOBALFOUNDRIES INC.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SCALING
- Publication number 20170221815
- Publication date Aug 3, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING A VOID BETWEEN A VIA AND A WIRING LINE
- Publication number 20160370421
- Publication date Dec 22, 2016
- GLOBALFOUNDRIES INC.
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Application
NOVEL INTEGRATION PROCESS TO FORM MICROELECTRONIC OR MICROMECHANICA...
- Publication number 20160322458
- Publication date Nov 3, 2016
- GLOBALFOUNDRIES Inc.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS AIR GAP CRACK STOP
- Publication number 20160181208
- Publication date Jun 23, 2016
- GLOBALFOUNDRIES INC.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE ETCH INTERCONNECTS
- Publication number 20160181200
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED VIA FUSE
- Publication number 20160104677
- Publication date Apr 14, 2016
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END ELECTRICALLY PROGRAMMABLE FUSE
- Publication number 20160027733
- Publication date Jan 28, 2016
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255343
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255398
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255342
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL INTEGRATION PROCESS TO FORM MICROELECTRONIC OR MICROMECHANICA...
- Publication number 20150243732
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS
- Publication number 20150235946
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL-DIMENSION-REDUCING METALLIC HARD MASK ETCH
- Publication number 20150235951
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FUSE WITH RESISTIVE HEATER
- Publication number 20150228578
- Publication date Aug 13, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FUSE STRUCTURE FOR IMPROVED PROGRAMMING CAPABILITY
- Publication number 20150137312
- Publication date May 21, 2015
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE AND METAL INTERCONNECTS WITH REDUCED CONTACT RESISTANCE
- Publication number 20150137377
- Publication date May 21, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FUSE WITH LOW DIELECTRIC CONSTANT
- Publication number 20150130018
- Publication date May 14, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA FUSE
- Publication number 20150048479
- Publication date Feb 19, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING A GRAPHENE-BASED BARRIE...
- Publication number 20150041981
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FUSE VIAS IN INTERCONNECT STRUCTURES
- Publication number 20150041951
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED VIA BOTTOM FOR BEOL VIA EFUSE
- Publication number 20150035115
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROFILE CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20150035154
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-METAL E-FUSE
- Publication number 20140346674
- Publication date Nov 27, 2014
- Junjing Bao
- B82 - NANO-TECHNOLOGY
Information Patent Application
High Performance Refractory Metal / Copper Interconnects To Elimina...
- Publication number 20140332965
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS

Samuel S. S. Choi

Person

Patents Grantslast 30 patents

Contact formation for vertical field effect transistors

Recessed interconnet line having a low-oxygen cap for facilitating...

Interconnect structure having subtractive etch feature and damascen...

Forming air gap

Self aligned via fuse

Subtractive etch interconnects

Detecting a void between a via and a wiring line

Back-end electrically programmable fuse

Interconnect structure having substractive etch feature and damasce...

Integration process to form microelectronic or micromechanical stru...

Back-end electrically programmable fuse

Interconnect structure having subtractive etch feature and damascen...

High performance refractory metal / copper interconnects to elimina...

Structure with air gap crack stop

Interconnect scaling method including forming dielectric layer over...

Selective local metal cap layer formation for improved electromigra...

Graphene-metal E-fuse

Alternate dual damascene method for forming interconnects

Metal fuse structure for improved programming capability

Selective local metal cap layer formation for improved electromigra...

Selective local metal cap layer formation for improved electromigra...

Method of forming microelectronic or micromechanical structures

Semiconductor interconnect structure having a graphene-based barrie...

Modified via bottom for beol via efuse

Semiconductor interconnect structure having a graphene-based barrie...

Graphene and metal interconnects with reduced contact resistance

Hybrid graphene-metal interconnect structures

Self-aligned via fuse

Graphene and metal interconnects

E-fuse with hybrid metallization

Patents Applicationslast 30 patents

SUB-EUV PATTERNING HEATERS FOR BAR MUSHROOM CELL PCM

CONTACT FORMATION FOR VERTICAL FIELD EFFECT TRANSISTORS

RECESSED INTERCONNET LINE HAVING A LOW-OXYGEN CAP FOR FACILITATING...

FORMING AIR GAP

INTERCONNECT SCALING

FORMING AIR GAP

INTERCONNECT SCALING

DETECTING A VOID BETWEEN A VIA AND A WIRING LINE

NOVEL INTEGRATION PROCESS TO FORM MICROELECTRONIC OR MICROMECHANICA...

DISCONTINUOUS AIR GAP CRACK STOP

SUBTRACTIVE ETCH INTERCONNECTS

SELF ALIGNED VIA FUSE

BACK-END ELECTRICALLY PROGRAMMABLE FUSE

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

NOVEL INTEGRATION PROCESS TO FORM MICROELECTRONIC OR MICROMECHANICA...

REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS

LATERAL-DIMENSION-REDUCING METALLIC HARD MASK ETCH

ELECTRONIC FUSE WITH RESISTIVE HEATER

METAL FUSE STRUCTURE FOR IMPROVED PROGRAMMING CAPABILITY

GRAPHENE AND METAL INTERCONNECTS WITH REDUCED CONTACT RESISTANCE

VIA-FUSE WITH LOW DIELECTRIC CONSTANT

SELF-ALIGNED VIA FUSE

SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING A GRAPHENE-BASED BARRIE...

ELECTRONIC FUSE VIAS IN INTERCONNECT STRUCTURES

MODIFIED VIA BOTTOM FOR BEOL VIA EFUSE

PROFILE CONTROL IN INTERCONNECT STRUCTURES

GRAPHENE-METAL E-FUSE

High Performance Refractory Metal / Copper Interconnects To Elimina...