San Leong Liew

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
- Patent number 7,524,755
- Issue date Apr 28, 2009
- Chartered Semiconductor Manufacturing, Ltd.
- Johnny Widodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form alpha phase Ta and its application to IC manufacturing
- Patent number 7,294,241
- Issue date Nov 13, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Chim Seng Seet
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
- Publication number 20070197023
- Publication date Aug 23, 2007
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Johnny Widodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to form alpha phase Ta and its application to IC manufacturing
- Publication number 20040131878
- Publication date Jul 8, 2004
- Chim Seng Seet
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...