Sandesh Geejagaaru KRISHNAMURTHY

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Bangalore, IN

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Patents Grantslast 30 patents

Information Patent Grant
Thermal solutions for package on package (PoP) architectures
- Patent number 11,538,731
- Issue date Dec 27, 2022
- Intel Corporation
- Bijendra Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD FOR IN-SITU MONITORING OF THERMAL INTERFACE MA...
- Publication number 20240379495
- Publication date Nov 14, 2024
- Intel Corporation
- Smit KAPILA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR SHIELDING AN INDUCTOR ON A CIRCUIT BOARD
- Publication number 20220015246
- Publication date Jan 13, 2022
- Intel Corporation
- Ranjul Balakrishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL SOLUTIONS FOR PACKAGE ON PACKAGE (POP) ARCHITECTURES
- Publication number 20200312736
- Publication date Oct 1, 2020
- Intel Corporation
- Bijendra SINGH
- H01 - BASIC ELECTRIC ELEMENTS