Sandra G. Malhotra

Person

Beacon, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact metallurgy structure
- Patent number 8,089,157
- Issue date Jan 3, 2012
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrodeposited contacts
- Patent number 7,851,357
- Issue date Dec 14, 2010
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of aligned capped metal lines and interconnections in mul...
- Patent number 7,825,516
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing deposition rates of metal layers from metal-c...
- Patent number 7,678,421
- Issue date Mar 16, 2010
- Tokyo Electron Limited
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preparing solid precursor tray for use in solid precurso...
- Patent number 7,488,512
- Issue date Feb 10, 2009
- Tokyo Electron Limited
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for processing a substrate
- Patent number 7,419,702
- Issue date Sep 2, 2008
- Tokyo Electron Limited
- Kazuhito Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method of forming electrodeposited contacts
- Patent number 7,405,154
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct electroplating of copper onto a non-copper platea...
- Patent number 7,405,153
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Sandra G. Malhotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing deposition rates of metal layers from metal-c...
- Patent number 7,270,848
- Issue date Sep 18, 2007
- Tokyo Electron Limited
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
On-chip Cu interconnection using 1 to 5 nm thick metal cap
- Patent number 7,247,946
- Issue date Jul 24, 2007
- International Business Machines Corporation
- John Bruley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-functional structure for enhanced chip manufacturibility and...
- Patent number 7,098,676
- Issue date Aug 29, 2006
- International Business Machines Corporation
- William F. Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing metal layers from metal-carbonyl precursors
- Patent number 7,078,341
- Issue date Jul 18, 2006
- Tokyo Electron Limited
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 7,064,064
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constant emissivity deposition member
- Patent number 7,037,834
- Issue date May 2, 2006
- International Business Machines Corporation
- Fenton Read McFeely
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-pressure deposition of metal layers from metal-carbonyl precursors
- Patent number 6,989,321
- Issue date Jan 24, 2006
- Tokyo Electron Limited
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for electroplating on resistive substrates
- Patent number 6,974,531
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 6,975,032
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing a metal layer on a semiconductor interconnect...
- Patent number 6,949,461
- Issue date Sep 27, 2005
- International Business Machines Corporation
- Sandra G. Malhotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal layer using an intermittent precursor gas...
- Patent number 6,924,223
- Issue date Aug 2, 2005
- Tokyo Electron Limited
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for thin film thickness mapping
- Patent number 6,909,772
- Issue date Jun 21, 2005
- Hypernex, Inc.
- Krzysztof J. Kozaczek
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for thin film thickness mapping
- Patent number 6,792,075
- Issue date Sep 14, 2004
- Hypernex, Inc.
- Krzysztof J. Kozaczek
- G01 - MEASURING TESTING
Information Patent Grant
Method for depositing metal films onto substrate surfaces utilizing...
- Patent number 6,660,330
- Issue date Dec 9, 2003
- International Business Machines Corporation
- Peter S. Locke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper seed layer repair technique using electroless touch-up
- Patent number 6,395,164
- Issue date May 28, 2002
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming an open-bottom liner for a conductor in an elect...
- Patent number 6,380,075
- Issue date Apr 30, 2002
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming barrier layers for damascene interconnects
- Patent number 6,358,832
- Issue date Mar 19, 2002
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual etch stop/diffusion barrier for damascene interconnects
- Patent number 6,153,935
- Issue date Nov 28, 2000
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a semiconductor structure having a self-ali...
- Patent number 6,090,722
- Issue date Jul 18, 2000
- International Business Machines Corporation
- Michael Armacost
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING ELECTRODEPOSITED CONTACTS
- Publication number 20110084393
- Publication date Apr 14, 2011
- International Business Machines Corporation
- Cyril Cabral, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS
- Publication number 20090014878
- Publication date Jan 15, 2009
- International Business Machines Corporation
- Cyril Cabral, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING...
- Publication number 20080237053
- Publication date Oct 2, 2008
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR INCREASING DEPOSITION RATES OF METAL LAYERS FROM METAL-C...
- Publication number 20080003360
- Publication date Jan 3, 2008
- TOKYO ELECTRON LIMITED
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS
- Publication number 20070222066
- Publication date Sep 27, 2007
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIRECT ELECTROPLATING OF COPPER ONTO A NON-COPPER PLATEA...
- Publication number 20070166995
- Publication date Jul 19, 2007
- International Business Machines Corporation
- Sandra G. Malhotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-chip Cu interconnection using 1 to 5 nm thick metal cap
- Publication number 20060160350
- Publication date Jul 20, 2006
- International Business Machines Corporation
- John Bruley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for performing in-situ cleaning of a deposition s...
- Publication number 20060115590
- Publication date Jun 1, 2006
- Tokyo Electron Limited; International Business Machines Corporation
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for preparing solid precursor tray for use in solid precurso...
- Publication number 20060115593
- Publication date Jun 1, 2006
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for increasing deposition rates of metal layers from metal-c...
- Publication number 20060110530
- Publication date May 25, 2006
- TOKYO ELECTRON LIMITED
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low-pressure deposition of ruthenium and rhenium metal layers from...
- Publication number 20060068588
- Publication date Mar 30, 2006
- TOKYO ELECTRON LIMITED
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Constant emissivity deposition member
- Publication number 20050260833
- Publication date Nov 24, 2005
- Fenton Read McFeely
- C30 - CRYSTAL GROWTH
Information Patent Application
Method of forming a metal layer
- Publication number 20050221000
- Publication date Oct 6, 2005
- TOKYO ELECTRON LIMITED
- Taro Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for processing a substrate
- Publication number 20050221002
- Publication date Oct 6, 2005
- TOKYO ELECTRON LIMITED
- Kazuhito Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20050199502
- Publication date Sep 15, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20050158985
- Publication date Jul 21, 2005
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diffusion barriers formed by low temperature deposition
- Publication number 20050110142
- Publication date May 26, 2005
- Michael Wayne Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing metal layers from metal-carbonyl precursors
- Publication number 20050079708
- Publication date Apr 14, 2005
- TOKYO ELECTRON LIMITED
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low-pressure deposition of metal layers from metal-carbonyl precursors
- Publication number 20050070100
- Publication date Mar 31, 2005
- TOKYO ELECTRON LIMITED
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of forming a metal layer using an intermittent precursor gas...
- Publication number 20050069632
- Publication date Mar 31, 2005
- TOKYO ELECTRON LIMITED
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for depositing metal layers using sequential flow deposition
- Publication number 20050069641
- Publication date Mar 31, 2005
- TOKYO ELECTRON LIMITED
- Tsukasa Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for thin film thickness mapping
- Publication number 20040170249
- Publication date Sep 2, 2004
- Krzysztof J. Kozaczek
- G01 - MEASURING TESTING
Information Patent Application
Multi-functional structure for enhanced chip manufacturibility & re...
- Publication number 20040129938
- Publication date Jul 8, 2004
- International Business Machines Corporation
- William F. Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of aligned capped metal lines and interconnections in mul...
- Publication number 20040113277
- Publication date Jun 17, 2004
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20040113279
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for depositing a metal layer on a semiconductor interconnect...
- Publication number 20040115928
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Sandra G. Malhotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure comprising a barrier layer of a tungsten alloy comprising...
- Publication number 20040108136
- Publication date Jun 10, 2004
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20040069648
- Publication date Apr 15, 2004
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR THIN FILM THICKNESS MAPPING
- Publication number 20040047447
- Publication date Mar 11, 2004
- Krzysztof J. Kozaczek
- G01 - MEASURING TESTING
Information Patent Application
Deformation-susceptible substrate holder for low-pressure MOCVD and...
- Publication number 20020146903
- Publication date Oct 10, 2002
- International Business Machines Corporation
- Peter S. Locke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Sandra G. Malhotra

Person

Patents Grantslast 30 patents

Contact metallurgy structure

Method of forming electrodeposited contacts

Formation of aligned capped metal lines and interconnections in mul...

Method for increasing deposition rates of metal layers from metal-c...

Method for preparing solid precursor tray for use in solid precurso...

Method for processing a substrate

Structure and method of forming electrodeposited contacts

Method for direct electroplating of copper onto a non-copper platea...

Method for increasing deposition rates of metal layers from metal-c...

On-chip Cu interconnection using 1 to 5 nm thick metal cap

Multi-functional structure for enhanced chip manufacturibility and...

Method of depositing metal layers from metal-carbonyl precursors

Copper recess process with application to selective capping and ele...

Constant emissivity deposition member

Low-pressure deposition of metal layers from metal-carbonyl precursors

Method for electroplating on resistive substrates

Copper recess process with application to selective capping and ele...

Method for depositing a metal layer on a semiconductor interconnect...

Method of forming a metal layer using an intermittent precursor gas...

Method and apparatus for thin film thickness mapping

Method and apparatus for thin film thickness mapping

Method for depositing metal films onto substrate surfaces utilizing...

Copper seed layer repair technique using electroless touch-up

Method for forming an open-bottom liner for a conductor in an elect...

Method of forming barrier layers for damascene interconnects

Dual etch stop/diffusion barrier for damascene interconnects

Process for fabricating a semiconductor structure having a self-ali...

Patents Applicationslast 30 patents

METHOD OF FORMING ELECTRODEPOSITED CONTACTS

STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS

STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING...

METHOD FOR INCREASING DEPOSITION RATES OF METAL LAYERS FROM METAL-C...

STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS

METHOD FOR DIRECT ELECTROPLATING OF COPPER ONTO A NON-COPPER PLATEA...

On-chip Cu interconnection using 1 to 5 nm thick metal cap

Method and system for performing in-situ cleaning of a deposition s...

Method for preparing solid precursor tray for use in solid precurso...

Method for increasing deposition rates of metal layers from metal-c...

Low-pressure deposition of ruthenium and rhenium metal layers from...

Constant emissivity deposition member

Method of forming a metal layer

Method for processing a substrate

Method for electroplating on resistive substrates

Copper recess process with application to selective capping and ele...

Diffusion barriers formed by low temperature deposition

Method of depositing metal layers from metal-carbonyl precursors

Low-pressure deposition of metal layers from metal-carbonyl precursors

Method of forming a metal layer using an intermittent precursor gas...

Method for depositing metal layers using sequential flow deposition

Method and apparatus for thin film thickness mapping

Multi-functional structure for enhanced chip manufacturibility & re...

Formation of aligned capped metal lines and interconnections in mul...

Copper recess process with application to selective capping and ele...

Method for depositing a metal layer on a semiconductor interconnect...

Structure comprising a barrier layer of a tungsten alloy comprising...

Method for electroplating on resistive substrates

METHOD AND APPARATUS FOR THIN FILM THICKNESS MAPPING

Deformation-susceptible substrate holder for low-pressure MOCVD and...