Sang Bo Bae

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Gyeongsangbuk-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and die bonding structure thereof
- Patent number 9,070,561
- Issue date Jun 30, 2015
- KEC Corporation
- Kyu Hyo Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND DIE BONDING STRUCTURE THEREOF
- Publication number 20150123253
- Publication date May 7, 2015
- KEC CORPORATION
- Kyu Hyo Hwang
- H01 - BASIC ELECTRIC ELEMENTS