Sang Ho Yu

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gap fill methods using catalyzed deposition
- Patent number 12,351,909
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyzed deposition of metal films
- Patent number 12,000,044
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,959,167
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device having an oxygen free platinum group metal film
- Patent number 11,894,233
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition on non-metallic surfaces
- Patent number 11,680,313
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Sang Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing a gap fill for DRAM
- Patent number 11,621,266
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing gate induced drain leakage in DRAM wordline
- Patent number 11,552,082
- Issue date Jan 10, 2023
- Applied Materials, Inc.
- Sung-Kwan Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen free deposition of platinum group metal films
- Patent number 11,488,830
- Issue date Nov 1, 2022
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for high reflectivity aluminum layers
- Patent number 11,421,318
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Jacqueline Wrench
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,384,429
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of titanium films
- Patent number 11,286,556
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for filling features with ruthenium
- Patent number 11,282,745
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Sang-Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap fill methods of forming buried word lines in DRAM without formi...
- Patent number 11,171,141
- Issue date Nov 9, 2021
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for n-type metal oxide semiconductor (NMOS) m...
- Patent number 11,075,276
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of aluminum oxide on metal surfaces
- Patent number 11,060,188
- Issue date Jul 13, 2021
- Applied Materials, Inc.
- Sang Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for copper metallization and methods of forming
- Patent number 10,930,550
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Seshadri Ganguli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing gate induced drain leakage in DRAM wordline
- Patent number 10,790,287
- Issue date Sep 29, 2020
- Applied Materials, Inc.
- Sung-Kwan Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of enabling seamless cobalt gap-fill
- Patent number 10,699,946
- Issue date Jun 30, 2020
- Applied Materials, Inc.
- Bhushan N. Zope
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt manganese vapor phase deposition
- Patent number 10,665,542
- Issue date May 26, 2020
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low thickness dependent work-function nMOS integration for metal gate
- Patent number 10,608,097
- Issue date Mar 31, 2020
- Applied Materials, Inc.
- Paul F. Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of cobalt films with high deposition rate
- Patent number 10,559,578
- Issue date Feb 11, 2020
- Applied Materials, Inc.
- Jacqueline S. Wrench
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Synthesis of metal nitride thin films materials using hydrazine der...
- Patent number 10,487,398
- Issue date Nov 26, 2019
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ pre-clean for selectivity improvement for selective deposition
- Patent number 10,395,916
- Issue date Aug 27, 2019
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of aluminum oxide on metal surfaces
- Patent number 10,358,719
- Issue date Jul 23, 2019
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of enabling seamless cobalt gap-fill
- Patent number 10,269,633
- Issue date Apr 23, 2019
- Applied Materials, Inc.
- Bhushan N. Zope
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for chemical vapor deposition of a cobalt layer
- Patent number 10,094,023
- Issue date Oct 9, 2018
- Applied Materials, Inc.
- Sang Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for thermally forming a selective cobalt layer
- Patent number 10,043,709
- Issue date Aug 7, 2018
- Applied Materials, Inc.
- Hua Ai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of depositing cobalt manganese films
- Patent number 9,953,926
- Issue date Apr 24, 2018
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to deposit CVD ruthenium
- Patent number 9,938,622
- Issue date Apr 10, 2018
- Applied Materials, Inc.
- Tae Hong Ha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming barrier/seed layers for copper interconnect str...
- Patent number 9,926,639
- Issue date Mar 27, 2018
- Applied Materials, Inc.
- Hoon Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20240218503
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Sang-Ho YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND SYSTEMS FOR FILLING GAP FEATURES ON SUBSTRATE SURFACES
- Publication number 20230295795
- Publication date Sep 21, 2023
- ASM IP HOLDING B.V.
- Yasiel Cabrera
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oxygen Free Deposition Of Platinum Group Metal Films
- Publication number 20230025937
- Publication date Jan 26, 2023
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL METHODS USING CATALYZED DEPOSITION
- Publication number 20220325410
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20220298625
- Publication date Sep 22, 2022
- Applied Materials, Inc.
- Sang-Ho YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND MATERIALS FOR ENHANCED BARRIER PERFORMANCE AND REDUCED...
- Publication number 20220122923
- Publication date Apr 21, 2022
- Applied Materials, Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILL METHODS FOR DRAM
- Publication number 20220068935
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF METAL FILMS
- Publication number 20210317570
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL METHODS USING CATALYZED DEPOSITION
- Publication number 20210285102
- Publication date Sep 16, 2021
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING GATE INDUCED DRAIN LEAKAGE IN DRAM WORDLINE
- Publication number 20200388621
- Publication date Dec 10, 2020
- Applied Materials, Inc.
- Sung-Kwan Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deposition On Non-Metallic Surfaces
- Publication number 20200350204
- Publication date Nov 5, 2020
- Applied Materials, Inc.
- Sang Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FILLING FEATURES WITH RUTHENIUM
- Publication number 20200343136
- Publication date Oct 29, 2020
- Applied Materials, Inc.
- SANG-HO YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILL METHODS FOR DRAM
- Publication number 20200286897
- Publication date Sep 10, 2020
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING GATE INDUCED DRAIN LEAKAGE IN DRAM WORDLINE
- Publication number 20200176451
- Publication date Jun 4, 2020
- Applied Materials, Inc.
- Sung-Kwan Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR N-TYPE METAL OXIDE SEMICONDUCTOR (NMOS) M...
- Publication number 20200111885
- Publication date Apr 9, 2020
- Applied Materials, Inc.
- YONGJING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming Via With Embedded Barrier
- Publication number 20200090991
- Publication date Mar 19, 2020
- Applied Materials, Inc.
- Sang Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Oxygen Free Deposition Of Platinum Group Metal Films
- Publication number 20200063263
- Publication date Feb 27, 2020
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYZED DEPOSITION OF METAL FILMS
- Publication number 20190390340
- Publication date Dec 26, 2019
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition
- Publication number 20190385838
- Publication date Dec 19, 2019
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR HIGH REFLECTIVITY ALUMINUM LAYERS
- Publication number 20190338415
- Publication date Nov 7, 2019
- Applied Materials, Inc.
- JACQUELINE WRENCH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selective Deposition Of Aluminum Oxide On Metal Surfaces
- Publication number 20190338417
- Publication date Nov 7, 2019
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Barrier for Copper Metallization and Methods of Forming
- Publication number 20190341304
- Publication date Nov 7, 2019
- Applied Materials, Inc.
- Seshadri Ganguli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods And Apparatus For Depositing Tungsten Nucleation Layers
- Publication number 20190017165
- Publication date Jan 17, 2019
- Applied Materials, Inc.
- Kai Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low Thickness Dependent Work-Function nMOS Integration For Metal Gate
- Publication number 20190019874
- Publication date Jan 17, 2019
- Applied Materials, Inc.
- Paul F. Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition Of Cobalt Films With High Deposition Rate
- Publication number 20180350826
- Publication date Dec 6, 2018
- Applied Materials, Inc.
- Jacqueline S. Wrench
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cobalt Manganese Vapor Phase Deposition
- Publication number 20180240755
- Publication date Aug 23, 2018
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Synthesis of Metal Nitride Thin Films Materials using Hydrazine Der...
- Publication number 20180155827
- Publication date Jun 7, 2018
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electromigration Improvement Using Tungsten For Selective Cobalt De...
- Publication number 20180144973
- Publication date May 24, 2018
- Applied Materials, Inc.
- Weifeng Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deposition Of Aluminum Oxide On Metal Surfaces
- Publication number 20180142348
- Publication date May 24, 2018
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition
- Publication number 20180076020
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Gap fill methods using catalyzed deposition

Catalyzed deposition of metal films

Selective cobalt deposition on copper surfaces

Electronic device having an oxygen free platinum group metal film

Selective deposition on non-metallic surfaces

Method of testing a gap fill for DRAM

Reducing gate induced drain leakage in DRAM wordline

Oxygen free deposition of platinum group metal films

Methods and apparatus for high reflectivity aluminum layers

Selective cobalt deposition on copper surfaces

Selective deposition of titanium films

Methods for filling features with ruthenium

Gap fill methods of forming buried word lines in DRAM without formi...

Methods and apparatus for n-type metal oxide semiconductor (NMOS) m...

Selective deposition of aluminum oxide on metal surfaces

Barrier for copper metallization and methods of forming

Reducing gate induced drain leakage in DRAM wordline

Method of enabling seamless cobalt gap-fill

Cobalt manganese vapor phase deposition

Low thickness dependent work-function nMOS integration for metal gate

Deposition of cobalt films with high deposition rate

Synthesis of metal nitride thin films materials using hydrazine der...

In-situ pre-clean for selectivity improvement for selective deposition

Selective deposition of aluminum oxide on metal surfaces

Method of enabling seamless cobalt gap-fill

Methods and apparatus for chemical vapor deposition of a cobalt layer

Methods for thermally forming a selective cobalt layer

Methods of depositing cobalt manganese films

Method to deposit CVD ruthenium

Methods for forming barrier/seed layers for copper interconnect str...

Patents Applicationslast 30 patents

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

METHODS AND SYSTEMS FOR FILLING GAP FEATURES ON SUBSTRATE SURFACES

Oxygen Free Deposition Of Platinum Group Metal Films

GAP FILL METHODS USING CATALYZED DEPOSITION

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

METHODS AND MATERIALS FOR ENHANCED BARRIER PERFORMANCE AND REDUCED...

GAP FILL METHODS FOR DRAM

DEPOSITION OF METAL FILMS

GAP FILL METHODS USING CATALYZED DEPOSITION

REDUCING GATE INDUCED DRAIN LEAKAGE IN DRAM WORDLINE

Selective Deposition On Non-Metallic Surfaces

METHODS FOR FILLING FEATURES WITH RUTHENIUM

GAP FILL METHODS FOR DRAM

REDUCING GATE INDUCED DRAIN LEAKAGE IN DRAM WORDLINE

METHODS AND APPARATUS FOR N-TYPE METAL OXIDE SEMICONDUCTOR (NMOS) M...

Method Of Forming Via With Embedded Barrier

Oxygen Free Deposition Of Platinum Group Metal Films

CATALYZED DEPOSITION OF METAL FILMS

In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition

METHODS AND APPARATUS FOR HIGH REFLECTIVITY ALUMINUM LAYERS

Selective Deposition Of Aluminum Oxide On Metal Surfaces

Barrier for Copper Metallization and Methods of Forming

Methods And Apparatus For Depositing Tungsten Nucleation Layers

Low Thickness Dependent Work-Function nMOS Integration For Metal Gate

Deposition Of Cobalt Films With High Deposition Rate

Cobalt Manganese Vapor Phase Deposition

Synthesis of Metal Nitride Thin Films Materials using Hydrazine Der...

Electromigration Improvement Using Tungsten For Selective Cobalt De...

Selective Deposition Of Aluminum Oxide On Metal Surfaces

In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition