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Kyounggi, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Ultra thin bumped wafer with under-film
Patent number
8,704,366
Issue date
Apr 22, 2014
STATS ChipPAC, Ltd.
Junghoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra thin bumped wafer with under-film
Patent number
8,329,554
Issue date
Dec 11, 2012
STATS ChipPAC, Ltd.
Junghoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra thin bumped wafer with under-film
Patent number
7,838,391
Issue date
Nov 23, 2010
STATS ChipPAC, Ltd.
Junghoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Ultra Thin Bumped Wafer With Under-Film
Publication number
20110045637
Publication date
Feb 24, 2011
STATS ChipPAC, Ltd.
Junghoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ultra Thin Bumped Wafer With Under-Film
Publication number
20110037172
Publication date
Feb 17, 2011
STATS ChipPAC, Ltd.
Junghoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ultra Thin Bumped Wafer with Under-Film
Publication number
20080280422
Publication date
Nov 13, 2008
STATS ChipPAC, Ltd.
Junghoon Shin
H01 - BASIC ELECTRIC ELEMENTS