SangHyun Son

Follow

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method using tape attachment
- Patent number 12,176,335
- Issue date Dec 24, 2024
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240105467
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME
- Publication number 20240096920
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Disposing Electrical Components...
- Publication number 20230395477
- Publication date Dec 7, 2023
- STATS ChipPAC Pte Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT DEVICE AND SEMICONDUCTOR ASSEMBLY INCORPORATING THE SAME
- Publication number 20230343717
- Publication date Oct 26, 2023
- STATS ChipPAC Pte Ltd.
- GunHyuck LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Using Tape Attachment
- Publication number 20230238376
- Publication date Jul 27, 2023
- STATS ChipPAC Pte Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS