SangJin Lee

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Seongnam-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with fan-in package and method...
- Patent number 9,093,391
- Issue date Jul 28, 2015
- Stats Chippac Ltd.
- SeungYun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit packaging system with su...
- Patent number 8,633,100
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package on package support...
- Patent number 8,530,277
- Issue date Sep 10, 2013
- Stats Chippac Ltd.
- ChanHoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with package stacking and method...
- Patent number 8,299,595
- Issue date Oct 30, 2012
- Stats Chippac Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METH...
- Publication number 20120319286
- Publication date Dec 20, 2012
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE ON PACKAGE SUPPORT...
- Publication number 20120319284
- Publication date Dec 20, 2012
- ChanHoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE STACKING AND METHOD...
- Publication number 20110227209
- Publication date Sep 22, 2011
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD...
- Publication number 20110062602
- Publication date Mar 17, 2011
- SeungYun Ahn
- H01 - BASIC ELECTRIC ELEMENTS