Sangkwon Lee

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Kyunggi-Do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package system with thermal die bonding
- Patent number 8,304,922
- Issue date Nov 6, 2012
- Stats Chippac Ltd.
- Sangkwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with a heat sink
- Patent number 8,030,755
- Issue date Oct 4, 2011
- Stats Chippac Ltd.
- Sangkwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system with thermal die bonding
- Patent number 7,714,451
- Issue date May 11, 2010
- Stats Chippac Ltd.
- Sangkwon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM WITH THERMAL DIE BONDING
- Publication number 20100176503
- Publication date Jul 15, 2010
- Sangkwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH A HEAT SINK
- Publication number 20070108587
- Publication date May 17, 2007
- STATS ChipPAC Ltd.
- Sangkwon Lee
- H01 - BASIC ELECTRIC ELEMENTS