SangMi Park

Person

Pucheon-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of using partial wafer singulation...
- Patent number 10,665,534
- Issue date May 26, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing authentication, electronic device and server...
- Patent number 9,872,176
- Issue date Jan 16, 2018
- Samsung Electronics Co., Ltd.
- Junghun Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of using partial wafer singulation...
- Patent number 9,799,590
- Issue date Oct 24, 2017
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission of digital content to select devices
- Patent number 9,794,606
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Sangmi Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming stacked semiconductor di...
- Patent number 9,318,380
- Issue date Apr 19, 2016
- STATS ChipPAC, Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming stacked semiconductor di...
- Patent number 8,816,404
- Issue date Aug 26, 2014
- STATS ChipPAC, Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having warpage prevention struc...
- Patent number 8,723,310
- Issue date May 13, 2014
- Stats Chippac Ltd.
- YiSu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with heat conduction and method...
- Patent number 8,679,900
- Issue date Mar 25, 2014
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stack interconnect and met...
- Patent number 8,466,567
- Issue date Jun 18, 2013
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stack interconnect and met...
- Patent number 8,372,695
- Issue date Feb 12, 2013
- Stats Chippac Ltd.
- SangMi Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias to Have...
- Publication number 20230275013
- Publication date Aug 31, 2023
- STATS ChipPAC Pte Ltd.
- SungSoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias to Have...
- Publication number 20190318984
- Publication date Oct 17, 2019
- STATS ChipPAC Pte Ltd.
- SungSoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using Partial Wafer Singulation...
- Publication number 20180019195
- Publication date Jan 18, 2018
- STATS ChipPAC Pte Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR AUTHENTICATION AND ELECTRONIC DEVICE SUPPORTING THE SAME
- Publication number 20170244688
- Publication date Aug 24, 2017
- Samsung Electronics Co., Ltd.
- Jaehwan Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR PROCESSING AUTHENTICATION, ELECTRONIC DEVICE AND SERVER...
- Publication number 20160080938
- Publication date Mar 17, 2016
- SAMSUNG ELECTRONICS CO., LTD.
- Junghun KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device and Method of Forming Stacked Semiconductor Di...
- Publication number 20140322865
- Publication date Oct 30, 2014
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION OF DIGITAL CONTENT TO SELECT DEVICES
- Publication number 20140325554
- Publication date Oct 30, 2014
- Samsung Electronics Co., Ltd.
- Sangmi PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device and Method of Using Partial Wafer Singulation...
- Publication number 20140264817
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE PREVENTION MECHANI...
- Publication number 20130334714
- Publication date Dec 19, 2013
- YiSu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF...
- Publication number 20130328220
- Publication date Dec 12, 2013
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT CONDUCTION AND METHOD...
- Publication number 20130154085
- Publication date Jun 20, 2013
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Stacked Semiconductor Di...
- Publication number 20130069239
- Publication date Mar 21, 2013
- STATS ChipPAC, Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND MET...
- Publication number 20120126428
- Publication date May 24, 2012
- SangMi Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND MET...
- Publication number 20120068319
- Publication date Mar 22, 2012
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS

SangMi Park

Person

Patents Grantslast 30 patents

Semiconductor device and method of using partial wafer singulation...

Method for processing authentication, electronic device and server...

Semiconductor device and method of using partial wafer singulation...

Transmission of digital content to select devices

Semiconductor device and method of forming stacked semiconductor di...

Semiconductor device and method of forming stacked semiconductor di...

Integrated circuit packaging system having warpage prevention struc...

Integrated circuit packaging system with heat conduction and method...

Integrated circuit packaging system with stack interconnect and met...

Integrated circuit packaging system with stack interconnect and met...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Conductive Vias to Have...

Semiconductor Device and Method of Forming Conductive Vias to Have...

Semiconductor Device and Method of Using Partial Wafer Singulation...

METHOD FOR AUTHENTICATION AND ELECTRONIC DEVICE SUPPORTING THE SAME

METHOD FOR PROCESSING AUTHENTICATION, ELECTRONIC DEVICE AND SERVER...

Semiconductor Device and Method of Forming Stacked Semiconductor Di...

TRANSMISSION OF DIGITAL CONTENT TO SELECT DEVICES

Semiconductor Device and Method of Using Partial Wafer Singulation...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE PREVENTION MECHANI...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT CONDUCTION AND METHOD...

Semiconductor Device and Method of Forming Stacked Semiconductor Di...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND MET...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND MET...